Automated TEM Sample Preparation Using CAD and FIB
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Solution Overview
Problem
The existing methods for preparing samples for transmission electron microscopy (TEM) are labor-intensive, time-consuming, and lack reproducibility, making it difficult to incorporate TEM analysis into integrated or in situ metrology for process control in semiconductor manufacturing, especially for small geometry features.
Innovation Solution
A partially or fully automated method for TEM sample creation, extraction, and measurement is developed, utilizing computer-aided design (CAD) data to locate target structures and specify fiducial marks, and employing advanced FIB systems with machine-vision based metrology and image recognition for precise fiducial placement and lamella creation, enabling rapid and reproducible sample preparation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual methods are used for TEM sample preparation, then flexibility and adaptability are maintained, but the process becomes labor-intensive and time-consuming
Solution Approach 1:
The system performs preliminary actions by automatically locating target structures using CAD data and fiducial marks before sample preparation begins. The automated positioning and alignment are completed in advance, enabling the subsequent preparation steps to proceed rapidly without manual intervention for positioning or alignment.
Solution Approach 2:
The system enables self-service by allowing the automated system to perform positioning, alignment, and preparation without human intervention. The computer-controlled stage, automated focus adjustment, and programmed sample manipulation enable the system to service itself through automated routines that eliminate the need for operator involvement in each preparation step.
2Reliability
If automated methods are used for TEM sample preparation, then productivity and reproducibility are improved, but device complexity increases
Solution Approach 1:
The system implements feedback through automated image capture and analysis that monitors sample positioning and preparation quality in real-time. The system uses feedback from detected fiducial marks and target structure images to automatically adjust positioning and alignment, ensuring consistent reproducible results while managing complexity through closed-loop control.
Solution Approach 2:
The system replaces manual mechanical operations with computer-controlled automated mechanisms. The mechanical stage positioning, sample manipulation, and focus adjustment are all substituted with programmable automated systems that reduce operational complexity through software control while improving reproducibility through precise, repeatable movements.
3Measurement precision
If TEM analysis is integrated into in-line metrology, then process control capability is improved, but the time required for sample preparation must be reduced
Solution Approach 1:
The system performs preliminary positioning and alignment using CAD data and fiducial marks before the actual sample preparation begins. This preliminary action ensures that when measurement is completed, the sample is already precisely positioned, eliminating time loss from manual positioning and enabling rapid integration into in-line metrology workflows.
Solution Approach 2:
The system maintains continuity of useful action by automating the entire preparation and measurement sequence without interruption. The computer-controlled system continuously performs positioning, preparation, and measurement in an uninterrupted automated workflow, eliminating idle time and enabling TEM to be integrated into continuous in-line metrology processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated process significantly reduces the time required for TEM sample preparation, increases throughput, and improves reproducibility, allowing for the integration of TEM measurement into in-line metrology for process control, with minimal site-to-site variation in lamella thickness and reduced labor intensity.
Implementation Method 1
employing advanced FIB systems with machine-vision based metrology and image recognition for precise fiducial placement and lamella creation
Data Source
AI summary
An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.