Automated Via Placement for High-Density Chip Package Power Networks
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Solution Overview
Problem
Manual via routing in power distribution networks for chip packages is costly, time-consuming, and prone to human error, especially in high-speed and high-power applications requiring high via density.
Innovation Solution
An automated via placement engine executes a dynamic via placement algorithm to optimize via placement in chip packages, utilizing user input to determine optimal via locations and generate placement instructions, reducing human intervention and improving via density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual via routing is performed using CAD software, then via placement can be completed with human control, but the process becomes costly, time-consuming, and prone to human error
Solution Approach 1:
The system performs automated via placement using algorithms that independently determine optimal via locations based on input parameters, eliminating the need for manual human operation in the via routing process while maintaining or improving placement accuracy
Solution Approach 2:
The patent replaces the manual mechanical process of via routing with an automated computational system that uses algorithms and processors to determine via placements, substituting human manual operations with automated electronic computing
2Reliability
If via density is increased for high-speed and high-power applications, then power integrity is improved, but the complexity of via routing increases
Solution Approach 1:
The system dynamically adjusts via placement strategies based on input parameters and application requirements, allowing the routing complexity to adapt to the needed via density while maintaining power integrity through optimized automated placement algorithms
Solution Approach 2:
The patent changes the approach from manual parameter control to automated parameter optimization, where the system automatically determines optimal via placement parameters based on design requirements, thereby managing complexity while achieving high via density
3Productivity
If automated via placement is implemented, then productivity and consistency are improved, but initial system complexity increases
Solution Approach 1:
The automated system is divided into distinct functional modules including parameter receiving components, processing components that execute placement algorithms, and output components that generate placement data, making the complex automation system manageable and maintainable while achieving high productivity
Data Source
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AI summary
Aspects of the disclosed technology include a method and a system for an automated process of via placement for a dynamic power distribution network in a chip package. A method for via placement in a chip package includes receiving, by one or more processors, user input defining a working area of the chip package and identifying bump X-Y coordinates and X-Y bump pitches within the defined working area. The one or more processors also identify via location parameters, which are defined by via pad stack design, the bump X-Y coordinates, and the X-Y bump pitches. Then the one or more processors determine via locations for each of a plurality of vias at one or more layers in the chip package based on the identified via location parameters and provide instructions for placing the plurality of vias at the determined via locations in the chip package.