Automation Hardware Configuration for Ambient-Temperature Power Scaling
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Solution Overview
Problem
Automation hardware assemblies are limited by high ambient temperatures, which restrict computing power due to passive cooling and electromagnetic compatibility requirements, leading to fluctuating performance and reduced power loss, making it difficult to maintain constant computing power and response times in industrial environments.
Innovation Solution
A method to dynamically adjust the computing power of hardware assemblies by adapting ambient temperature parameters in the configuration software, allowing for increased processor clock rates and core usage based on current conditions without additional cooling measures, ensuring safe operation within specified temperature limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hardware assemblies are designed for high ambient temperatures with passive cooling, then reliability is improved, but computing power deteriorates due to limited power loss
Solution Approach 1:
The patent implements dynamic adjustment of computing power based on ambient temperature conditions. The system monitors ambient temperature and dynamically adapts processor clock rates and core usage to maximize computing power while staying within thermal limits. This resolves the contradiction by making the system flexible rather than static, allowing it to operate at higher performance levels when conditions permit while maintaining reliability when temperatures are high.
2Productivity
If processor clock rate is increased to improve computing power, then productivity is improved, but temperature increases making safe operation difficult
Solution Approach 1:
The patent employs feedback mechanisms where the system continuously monitors ambient temperature and uses this information to adjust processor clock rates and core usage. The feedback loop ensures that computing power is increased only when thermal conditions allow, and reduced when temperatures approach unsafe levels. This resolves the contradiction by creating a self-regulating system that balances performance with thermal safety.
3Temperature
If hardware assemblies use fans for active cooling to reduce temperature, then temperature is reduced, but reliability deteriorates due to dirt accumulation and reduced MTBF
Solution Approach 1:
The patent converts the harmful effect of high ambient temperatures into a beneficial control mechanism. Rather than fighting the heat with active cooling that reduces reliability, the system uses temperature monitoring to dynamically adjust computing power. This approach accepts the thermal environment as a given constraint and optimizes performance within those bounds, effectively converting the thermal challenge into a basis for intelligent power management that preserves reliability.
4Productivity
If configuration is optimized for maximum computing power, then productivity is improved, but adaptability deteriorates as computing power fluctuates with environmental conditions
Solution Approach 1:
The patent implements dynamic configuration that automatically adapts to environmental conditions. The system monitors ambient temperature and dynamically adjusts processor clock rates and core usage to maintain optimal computing power within thermal constraints. This resolves the contradiction by making the configuration flexible rather than fixed, allowing the system to adapt its performance level to match environmental conditions while maintaining operational stability through controlled adaptation.
Data Source
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AI summary
The invention relates to a method for configuring hardware assemblies (11, 12, 13) in an automation system (100) comprising the steps: a) opening or creating a project (101) in a project configuration software (2), b) opening or creating, in this project (101), a station (10) with a number of slots (10a, 10b, 10c), c) opening a hardware catalog (5) comprising a plurality of hardware assembly master data sets (51, ..., 510), d) inserting at least one hardware assembly master data set (51, ..., 510) of a hardware assembly (11, 12, 13) from the hardware catalog (5) into the station (10), characterized in that e) an adaptation step for the at least one hardware assembly master data set (51, ...,510) is carried out, specifying at least one environment parameter (20) which represents the environmental conditions at the deployment location of the at least one hardware assembly (11,12,13), f) storing the station (10) with the at least one hardware assembly master data set (51,...,510) inserted into the station and its at least one environment parameter (20).