Automotive LED Lamp Module with Integrated Heat Sink
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Solution Overview
Problem
Existing lamp modules for automotive use, particularly those employing high power LEDs, face challenges in achieving optimal heat dissipation and light distribution while being compact, simple, and cost-effective, with previous solutions often resulting in complex and expensive designs that do not adequately address thermal management and light guidance.
Innovation Solution
A lamp module design featuring a metallic heat sink with an integrated electronic driver circuit, where the LED is directly mounted on the heat sink for efficient thermal dissipation, and a plastic connector housing for cost-effective production, along with a compact and flexible electrical connection system, ensuring efficient heat dissipation and optimal light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a plastic housing with light guide is used, then the structure is simplified, but heat dissipation becomes insufficient and light distribution is compromised
Solution Approach 1:
The patent merges the housing structure with the heat sink by integrating a metallic heat dissipation component directly into the housing. The metal insert is embedded within the plastic housing, creating a hybrid structure that combines the manufacturing simplicity of plastic injection molding with the superior thermal conductivity of metal, thereby resolving the contradiction between structural simplicity and heat dissipation effectiveness.
Solution Approach 2:
The patent employs composite construction by combining plastic material for the housing with metallic material for the heat sink. This composite approach allows the housing to maintain its simplicity and cost-effectiveness while the metal portion provides efficient thermal management, simultaneously addressing both requirements of structural simplicity and adequate heat dissipation.
2Adaptability or versatility
If driver electronics are integrated into the lamp module, then control flexibility is improved, but device complexity increases
Solution Approach 1:
The driver electronics are integrated directly into the housing structure through embedding or mounting on the heat sink surface. This merging of functional components (electronics, housing, heat sink) into a single unified module reduces the number of separate parts and assembly steps, thereby maintaining control flexibility while minimizing the increase in device complexity.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical protection, acts as part of the heat dissipation system, and serves as the mounting platform for the driver electronics. This multi-functionality reduces the need for additional separate components, thereby improving control flexibility without proportionally increasing device complexity.
3Illumination intensity
If multiple lamp modules are arranged in proximity, then lighting coverage is improved, but space requirements increase
Solution Approach 1:
The driver electronics are nested within the housing structure, and the heat sink is integrated into the same housing. This nested arrangement of components within a compact housing allows multiple lamp modules to be arranged in closer proximity, thereby improving lighting coverage without proportionally increasing the space occupied by each module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective, and efficient lamp module with enhanced thermal management and light distribution, allowing for flexible control of the LED lighting while maintaining a simple and stable mechanical structure, suitable for high power LED applications in automotive lighting.
Implementation Method 1
The LED element is located at the top wall of the heat sink element. It is in direct thermal contact with the heat sink element, i.e. directly mounted to it in a way ensuring good thermal connection. Thus, the heat sink element can efficiently dissipate the heat generated at the LED element.
Implementation Method 2
an LED lighting element with a driver circuit
Data Source
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AI summary
A lamp module (10) comprises an LED lighting element (18) and an electronic driver circuit (42) for supplying electrical power to the LED element (18). An electrical connector (14) is connected to the electronic driver circuit (42). A bayonet coupling (16) is provided for positioning and locking the module (10) within a reflector (70). A metallic heat sink (30) with a top wall (34a, 34b, 34c) and a side wall (36a, 36b, 36c) has an inner cavity (40), where the electronic driver circuit (42) is located. The LED element (18) is located at the top wall (34)a in direct thermal contact to the heat sink (30). A lighting unit comprises the above-described lamp module (10) and a reflector (70) with a mounting cavity (74). The module (10) is mounted within the cavity (74), so that the light emitted from the LED (18) is reflected by a reflector surface (72) of the reflector (70).