Automotive Electronic Module Polymer Housing Thermal Shielding

Solution Overview

Problem

Electronic modules in automotive vehicles, such as radar and lidar modules, require additional components like EMI shields and heat sinks to function effectively, which increase cost and weight, posing a challenge in the industry's demand for smaller and lighter components.

Innovation Solution

An electronic module is designed with a housing and cover made from a polymer composition that exhibits high thermal conductivity and electromagnetic shielding effectiveness, eliminating the need for conventional EMI shields and heat sinks by integrating these properties into the polymer matrix.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional EMI shields and heat sinks are added to protect electronic components, then electromagnetic shielding effectiveness and thermal management are improved, but device weight and cost increase

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidmodule weight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent combines multiple functions (EMI shielding, thermal management, and structural support) into a single integrated housing component made from polymer composite material. This eliminates the need for separate EMI shields and heat sinks, thereby reducing overall module weight while maintaining shielding effectiveness and thermal dissipation capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs polymer composite materials with embedded conductive fillers (such as metal particles or carbon-based materials) to achieve both EMI shielding and thermal management properties within the housing itself. The composite structure provides electromagnetic interference protection and heat dissipation without requiring additional metal components, thus reducing weight.

Inventive Principle:

Principle #40Composite materials

2Reliability

If conventional EMI shields and heat sinks are added to protect electronic components, then electromagnetic shielding effectiveness and thermal management are improved, but device cost increases

Engineering Contradiction:

Improvethermal managementVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple functions (EMI shielding, thermal management, and structural support) into a single integrated housing component made from polymer composite material. This eliminates the need for separate EMI shields and heat sinks, thereby reducing overall module weight while maintaining shielding effectiveness and thermal dissipation capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs polymer composite materials with embedded conductive fillers (such as metal particles or carbon-based materials) to achieve both EMI shielding and thermal management properties within the housing itself. The composite structure provides electromagnetic interference protection and heat dissipation without requiring additional metal components, thus reducing weight.

Inventive Principle:

Principle #40Composite materials

3Reliability

If additional components are added to ensure effective operation of electronic components, then component protection and performance are improved, but device complexity increases

Engineering Contradiction:

Improvecomponent protectionVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent designs the housing to serve multiple functions simultaneously: it provides structural support, EMI shielding, thermal management, and component mounting. This multi-functional approach eliminates the need for separate dedicated components for each function, thereby reducing device complexity while maintaining comprehensive protection and performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines multiple functions (EMI shielding, thermal management, and structural support) into a single integrated housing component made from polymer composite material. This eliminates the need for separate EMI shields and heat sinks, thereby reducing overall module weight while maintaining shielding effectiveness and thermal dissipation capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer composition provides effective thermal management and electromagnetic interference shielding, reducing the module's weight and cost while maintaining performance, thus addressing the industry's need for lighter and more efficient components.

Implementation Method 1

a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11129312B2Electronic module for use in an automotive vehicle

Publication Date: 2021.09.21 TICONA LLC

AI summary

An electronic module that comprises a housing; a cover that is disposed over the housing to define an interior; and one or more electronic components positioned within the interior is provided. At least a portion of the housing, cover, or both contain a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.