Auxiliary Circuit Board Nesting for Compact Camera Module
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Solution Overview
Problem
The existing camera module structure in electronic devices, particularly smartphones, faces a challenge in minimizing the area occupied by the camera region on the screen while accommodating a Time of Flight (TOF) device, as the spacing between adjacent camera modules is limited, preventing further reduction in the camera region's opening size.
Innovation Solution
The camera module structure incorporates a mainboard with hollowed-out mounting portions for camera modules and an auxiliary circuit board that overlaps the spacing portion, allowing the TOF device to be mounted between the modules, with a material removal portion on the auxiliary circuit board to avoid structural conflicts and enable a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the spacing between adjacent front-facing camera modules is reduced to minimize the camera region area, then the screen-to-body ratio is improved, but the TOF device cannot be placed due to insufficient space
Solution Approach 1:
The patent introduces an auxiliary circuit board that extends in the vertical dimension (thickness direction) rather than only in the horizontal spacing direction. By utilizing the vertical space between the mainboard and the camera modules, the auxiliary circuit board provides additional mounting area for the TOF device without increasing the horizontal camera region area, thus resolving the space constraint contradiction.
Solution Approach 2:
The auxiliary circuit board is positioned between the mainboard and the camera modules, effectively nesting it within the existing structural space. This nested configuration allows the TOF device to be mounted on the auxiliary circuit board within the camera region without requiring additional external space, enabling compact integration.
2Ease of operation
If the width of the TOF device is increased to accommodate the device, then the TOF device can be properly mounted, but the spacing between camera module brackets becomes insufficient
Solution Approach 1:
Instead of increasing the horizontal width of the TOF device, the patent utilizes the vertical dimension by introducing an auxiliary circuit board with greater thickness. This allows the TOF device to be mounted with sufficient space while maintaining compact horizontal spacing between camera module brackets.
Solution Approach 2:
The auxiliary circuit board serves as an intermediary component between the mainboard and the TOF device. It provides a mounting surface for the TOF device while being positioned within the existing bracket spacing, thus mediating the space constraint and enabling proper TOF device installation without increasing horizontal dimensions.
Data Source
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AI summary
A camera module structure and an electronic device, where the camera module structure includes a mainboard, a first camera module, a second camera module, and a TOF device. The TOF device is located between the first camera module and the second camera module, and the first camera module and the second camera module are respectively mounted to a first mounting portion and a second mounting portion that are hollowed-out via the brackets. The mainboard includes a spacing portion for separation between the first mounting portion and the second mounting portion. The TOF device is disposed on an upper surface of an auxiliary circuit board; a width of the auxiliary circuit board is greater than a width of the spacing portion; the auxiliary circuit board is located on an upper surface of the mainboard, and the auxiliary circuit board is connected to the mainboard and at least partially overlapped with the spacing portion; and the auxiliary circuit board is provided with a material removal portion on a lower surface, to form a partially suspended portion. The camera module structure can further narrow an opening of a camera region, and reduce an area occupied by a TOF device when the TOF device is arranged on a mainboard.