Auxiliary Conductive Layer for Flexible Circuit Heat Dissipation
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Solution Overview
Problem
Flexible printed circuits with connectors face challenges in effectively releasing heat generated by contact resistance, leading to potential overheating and mechanical issues due to dense point contacts.
Innovation Solution
Incorporating an auxiliary conductive layer with high thermal conductivity, independent of the wiring pattern, at the connection point between the circuit body and the connector, which extends along the circuit body and has a linear or corrugated edge shape to enhance heat dissipation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple wiring patterns are densely connected to the connector, then electrical connection capability is improved, but heat concentration occurs at the contact points
Solution Approach 1:
The patent transitions from two-dimensional dense wiring patterns to a three-dimensional multilayered auxiliary conductive layer structure. By stacking multiple conductive layers at the connection portion, the heat dissipation pathway is extended into the thickness dimension, allowing heat to be conducted away from the connector contact points through multiple layers simultaneously, thereby reducing heat concentration while maintaining electrical connection density.
Solution Approach 2:
The auxiliary conductive layer acts as an intermediary between the wiring patterns and the connector. This intermediate conductive structure receives heat from the dense wiring-connector contact points and conducts it away through its extended structure, serving as a thermal mediator that protects the original contact points from excessive heat accumulation.
2Temperature
If auxiliary conductive layer is added for heat dissipation, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The auxiliary conductive layer serves multiple functions simultaneously: it provides thermal conduction pathways for heat dissipation, maintains mechanical stiffness at the connection portion, and offers additional electrical conduction paths. By integrating these multiple functions into a single structural element, the patent avoids the need for separate components for each function, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent employs composite material structures where the auxiliary conductive layer is integrated with the flexible board and wiring patterns. This composite approach allows the conductive layer to be formed using similar materials and processes as the existing circuit board structure, reducing manufacturing complexity despite the added functional capability.
3Adaptability or versatility
If circuit body is made flexible for deformation, then adaptability is improved, but mechanical separation of contact points occurs
Solution Approach 1:
The auxiliary conductive layer acts as a counterbalancing stiffening element at the connection portion. While the flexible board allows deformation elsewhere, the multilayered conductive structure at the connection points provides mechanical reinforcement that counteracts the flexibility-induced separation forces, maintaining contact stability during flexible deformation.
Solution Approach 2:
The patent applies different mechanical properties to different regions: the bulk of the flexible board remains soft and deformable for adaptability, while the auxiliary conductive layer at the connection portion provides localized stiffness and reinforcement. This local quality differentiation allows the circuit body to be flexible where needed while maintaining contact stability where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The auxiliary conductive layer effectively releases heat from the connector, improving thermal performance and preventing mechanical separation of contact points, thus enhancing the stiffness and reliability of the connection.
Implementation Method 1
the auxiliary conductive layer provided so as to be multilayered for the wiring pattern independently of the wiring pattern is high in thermal conductivity because it is made of a metal. This enables the heat in the connector to be released to the outside through the auxiliary conductive layer.
Data Source
AI summary
A connector-equipped circuit body includes a circuit body configured by a flexible board where a wiring pattern formed of a conductor for electric connection is provided, and a connector connected to the circuit body. At a connection portion of connection between the circuit body and the connector, an auxiliary conductive layer independent of the wiring pattern is provided so as to be multilayered for the wiring pattern.