Auxiliary Conductive Structure for Touch Electrode Signal Uniformity
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Solution Overview
Problem
Conventional touch structures using transparent conductive materials like indium tin oxide (ITO) for touch electrodes suffer from high resistance, leading to signal delay and attenuation, resulting in non-uniform signal transmission and affecting touch performance.
Innovation Solution
A touch structure is designed with an auxiliary conductive structure having higher conductivity than the touch electrode, coupled to the touch electrode at multiple positions through via-holes in an insulation layer, allowing for improved signal transmission and uniformity, using a net-like structure or direct contact to enhance conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent conductive material such as indium tin oxide (ITO) is used for touch electrode, then the touch electrode can be formed with transparency, but the resistance is relatively large causing signal delay and attenuation
Solution Approach 1:
The patent combines the transparent conductive material layer (maintaining transparency) with a metal auxiliary conductive structure (providing low resistance) to form a composite conductive system. The metal auxiliary conductive structure is coupled to the touch electrode through via-holes, creating a parallel conduction path that reduces overall resistance while preserving optical transparency.
Solution Approach 2:
The patent uses a composite structure consisting of transparent conductive material (such as ITO) combined with metal materials (such as aluminum or copper) to create a hybrid conductive system. This composite approach leverages the transparency of oxide materials and the high conductivity of metals to simultaneously achieve both optical clarity and electrical performance.
2Device complexity
If signal line directly couples to touch electrode through via-hole, then the structure is simple, but the signal transmission is non-uniform due to high resistance
Solution Approach 1:
The patent merges the traditional direct coupling structure with an auxiliary conductive network, creating a hybrid structure where the metal auxiliary conductive structure works in parallel with the signal line to provide multiple conduction paths, thereby improving signal uniformity without significantly increasing structural complexity.
Solution Approach 2:
The patent introduces an additional conductive dimension by adding the metal auxiliary conductive structure that extends in directions different from the signal line, providing alternative conduction paths and improving signal distribution across the touch electrode area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The auxiliary conductive structure effectively reduces resistance and ensures smooth signal transmission to multiple positions of the touch electrode, improving touch effect and uniformity by bypassing direct signal line limitations.
Implementation Method 1
the auxiliary conductive structure has a conductivity greater than that of the touch electrode... the auxiliary conductive structure is coupled to the first signal line through a first via-hole penetrating through the first insulation layer
Data Source
AI summary
The present disclosure provides a touch structure and a method for manufacturing the touch structure, a touch substrate and a display substrate. The touch structure includes: a touch electrode; a first signal line and an auxiliary conductive structure provided at a side of the touch electrode, the auxiliary conductive structure has a conductivity greater than that of the touch electrode; and a first insulation layer provided between the auxiliary conductive structure and the first signal line, the auxiliary conductive structure is coupled to the touch electrode at multiple coupling positions and is coupled to the first signal line through a first via-hole penetrating through the first insulation layer.