Auxiliary Conductor Segmentation for Laser-Divided Wiring Substrates
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Solution Overview
Problem
Existing multi-piece wiring substrates face challenges in maintaining electrical connectivity and preventing disconnection during the laser-based dividing process, especially when reducing substrate size, due to the disconnection of auxiliary conductors and inner surface conductors.
Innovation Solution
The implementation of an auxiliary conductor structure with a wide conductor connected to the connection conductor and a narrow conductor not connected to it, positioned across the boundaries between wiring substrate regions, helps prevent disconnection by maintaining a sufficient conduction path and insulation, even when forming dividing grooves with a laser.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the substrate size is reduced to improve integration density, then the area of wiring substrate regions is reduced, but the auxiliary conductors and inner surface conductors become disconnected during laser dividing
Solution Approach 1:
The auxiliary conductor is segmented into two distinct parts: a wide conductor portion and a narrow conductor portion. The wide conductor is positioned to bridge across the dividing groove formed by laser cutting, while the narrow conductor connects to the inner surface conductor. This segmentation allows the conductor to maintain electrical connectivity despite the physical separation caused by substrate division, solving the disconnection problem while enabling reduced substrate sizing.
Solution Approach 2:
The auxiliary conductor exhibits local quality variation through its wide and narrow portions. The wide conductor portion provides robust bridging across the dividing groove with sufficient width to prevent laser-induced disconnection, while the narrow portion maintains connection to the inner surface conductor. This localized differentiation in conductor geometry optimizes both connectivity reliability and space utilization for reduced substrate area.
2Productivity
If the dividing groove is formed by laser to separate wiring substrate regions, then productivity is improved through simultaneous multi-piece manufacturing, but disconnection of conductors occurs
Solution Approach 1:
The auxiliary conductor with its wide bridging portion is pre-configured before laser dividing occurs. This preliminary structural arrangement ensures that when the laser subsequently forms the dividing groove to separate multiple wiring substrate regions, the wide conductor already spans across the future groove location, preventing disconnection. This preliminary action enables high-productivity simultaneous manufacturing while maintaining conductor integrity.
3Reliability
If the wide conductor is disposed across the boundary of adjacent wiring substrate regions, then electrical connectivity is maintained during laser dividing, but the conductor structure becomes more complex
Solution Approach 1:
The auxiliary conductor implements local quality by having a wide portion only where needed to bridge the dividing groove, and a narrow portion where it connects to the inner surface conductor. This localized structural differentiation maintains electrical connectivity across the boundary during laser dividing while minimizing overall complexity by avoiding uniform widening throughout the entire conductor path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable electrical connectivity between adjacent wiring substrate regions and prevents disconnection, allowing for efficient electroplating of metal layers and improved connection reliability, even as substrate sizes are reduced.
Implementation Method 1
A method of providing the dividing groove by a laser has been proposed
Implementation Method 2
the wide conductor is disposed across the boundary of the wiring substrate regions adjacent to each other
Data Source
AI summary
A multi-piece wiring substrate includes a matrix substrate including a first main surface, a second main surface opposite to the first main surface, a third main surface disposed between the first main surface and the second main surface, an arrangement of a plurality of wiring substrate regions, a margin region surrounding the plurality of wiring substrate regions, and a dividing groove. The multi-piece wiring substrate further includes a through-hole disposed across the boundary between the wiring substrate regions or the boundary between the wiring substrate regions and the margin region, and which penetrates from the first main surface to the second main surface, and an external connection conductor at each corner of the wiring substrate regions on the second main surface. An auxiliary conductor is disposed around the through-hole on the third main surface.