Auxiliary Cover Sheet for Electronic Device Assembly Cooling
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Solution Overview
Problem
Traditional switching power supply devices face issues with heat dissipation during assembly, as heat dissipation sheets with high friction coefficients can deform or dislocate, leading to inadequate cooling and increased assembly resistance, which hinders miniaturization efforts.
Innovation Solution
An auxiliary assembly structure featuring a cover sheet with a lower friction coefficient than the heat dissipation sheet, positioned between the heat dissipation sheet and the case, with openings to ensure effective cooling and improved assembly by preventing direct contact between the heat dissipation sheet and the case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation sheets are provided between the heat generating component and the case to improve cooling, then the cooling effect is improved, but the assembling resistance increases and the heat dissipation sheets may deform or dislocate
Solution Approach 1:
The patent introduces an auxiliary assembly structure as an intermediary component between the heat dissipation sheet and the case. This auxiliary structure has a friction coefficient smaller than that of the heat dissipation sheet, which reduces the overall friction during assembly while maintaining the heat dissipation function. The auxiliary assembly structure acts as a mediator that resolves the conflict between achieving good cooling effect and ensuring easy assembly.
2Ease of manufacture
If the heat dissipation sheets are separated from the case by a specified distance to improve assembling property, then the assembling resistance is reduced, but the overall size of the device increases
Solution Approach 1:
The patent employs the auxiliary assembly structure as a flexible interface layer that can deform to accommodate the heat dissipation sheet while maintaining close contact. This thin film-like structure allows the heat dissipation sheet to remain in effective contact with the case without requiring large separation distances, thus reducing device volume while improving assembleability.
3Temperature
If the surface of the case has high friction coefficient to improve contact with heat dissipation sheets, then the cooling effect is improved, but the assembling resistance increases
Solution Approach 1:
The patent applies different friction characteristics to different parts of the assembly system. The auxiliary assembly structure has low friction coefficient to facilitate assembly, while the heat dissipation sheet maintains high friction coefficient with the case to ensure good thermal contact. This local differentiation of friction properties resolves the contradiction between easy assembly and effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the assembly process by reducing resistance and maintaining effective cooling, as demonstrated by a temperature reduction of 15-20°C for the transformer, while ensuring the heat dissipation functionality is preserved.
Implementation Method 1
heat dissipation sheets are provided between a heat generating component serving as a heat generating component and the case so that the heat generating component is in effective contact with the case via the heat dissipation sheets to effectively transfer heat to the case for cooling
Implementation Method 2
a cover sheet which is provided between the heat dissipation sheet and the case and of which the friction coefficient is smaller than that of the heat dissipation sheet
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Provided is an electronic device with an auxiliary assembly structure. The electronic device can guarantee the cooling function of the heat dissipation sheets, and can improve the assembling property of the electronic device, wherein the electronic device in which a heat generating component covered with the heat dissipation sheets cover is installed, is assembled into the case in a transverse sliding manner. The electronic device with the auxiliary assembly structure is formed by inserting an electronic device main body into the case. The electronic device main body includes a substrate, a heat generating component including a heat generating component main body and mounting pins and being mounted on the substrate via the mounting pins, and a heat dissipation sheet provided on a part of the heat generating component main body that faces the case, and/or a part of the mounting pins that faces the case, the auxiliary assembly structure is a cover sheet which is provided between the heat dissipation sheets and the case and with a friction coefficient being smaller than that of the heat dissipation sheets, at least one opening is formed in the cover sheet at a position covering the heat dissipation sheets, and a peripheral part surrounding the opening is in contact with the heat dissipation sheet.