Auxiliary Fan Heat Dissipating Module for 3C Cards
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Solution Overview
Problem
Current heat dissipation technologies for 3C products, such as display cards, sound cards, and network cards, face inefficiencies in cooling due to high temperatures, which can damage electronic components, despite the use of air cooling methods with fans and coolers.
Innovation Solution
A heat dissipating module incorporating a centrifugal fan, airflow guiding hood, and an auxiliary fan is designed to enhance heat dissipation efficiency by creating a dual airflow system between fins and airflow openings, with the auxiliary fan positioned between the fins and airflow openings to augment heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single fan is used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation system is segmented into two independent airflow paths: a main airflow path with a centrifugal fan for general cooling, and an auxiliary airflow path with an auxiliary fan positioned between the fins and second airflow opening for enhanced heat removal. This segmentation allows each fan to optimize its function while collectively improving overall heat dissipation efficiency.
2Reliability
If heat dissipation efficiency is improved by adding more fans, then cooling performance increases, but device complexity increases
Solution Approach 1:
The auxiliary fan is strategically positioned at a specific location between the fins and the second airflow opening, creating a localized high-velocity airflow zone where it is most needed for heat removal. This local quality enhancement allows targeted heat dissipation improvement without requiring multiple fans throughout the entire system.
3Reliability
If airflow velocity is increased to improve heat dissipation, then heat removal efficiency improves, but energy consumption increases
Solution Approach 1:
The main airflow path and auxiliary airflow path are merged into a unified heat dissipation system where the centrifugal fan provides the primary cooling airflow and the auxiliary fan supplements it in critical heat zones. This merging allows the system to achieve high heat dissipation efficiency through coordinated operation, optimizing the total energy consumption compared to using a single high-power fan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual airflow system significantly improves heat dissipation efficiency by jointly accelerating airflow through the heat dissipating channels, effectively reducing the temperature of electronic components and maintaining a compact module design.
Implementation Method 1
a cooler is attached on an add-on card and a fan is installed on a side of the cooler to dissipate heat from the cooler by convection
Implementation Method 2
The auxiliary fan is disposed between the fins and the second airflow opening to increase efficiency of heat dissipation
Implementation Method 3
a cooler is attached on an add-on card
Data Source
AI summary
A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.