Auxiliary Heat-Dissipating Module for Flat Panel Devices
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Solution Overview
Problem
Heat accumulation in flat panel electronic devices due to sealed housings limits their performance and can cause rapid deterioration or burning, as reducing the processing speed of heat-dissipating elements is necessary to prevent overheating.
Innovation Solution
An auxiliary heat-dissipating module with a base heat sink and a heat-conducting plug that thermally contacts the base heat sink and extends into a heat-conducting socket of the device, creating a heat-dissipating path to diffuse heat away from the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing is sealed to protect internal electronic components and prevent dust entry, then reliability is improved, but heat accumulation occurs causing temperature to increase
Solution Approach 1:
A heat-conducting plug is introduced as an intermediary component between the heat-generating element and the heat sink. The plug thermally couples these two components, providing a dedicated heat transfer pathway that does not compromise the sealed housing structure. This mediator enables efficient heat dissipation while maintaining the protective sealing of the device interior.
2Temperature
If processing speed of heat-dissipating elements is reduced to prevent overheating, then temperature is controlled, but performance is limited
Solution Approach 1:
The heat dissipation function is extracted from the processing elements themselves and relocated to a separate, dedicated heat sink system. By removing the heat-generating elements from the sealed interior and coupling them thermally to an external heat sink via the heat-conducting plug, the system can maintain high processing speeds while the extracted heat is dissipated outside the sealed housing.
3Temperature
If a heat-dissipating element is disposed inside the housing, then heat dissipation is provided, but the element occupies space and increases device volume
Solution Approach 1:
The heat-conducting plug is nested within the existing device structure, utilizing the space between the heat-generating element and the housing interior. The plug extends from the interior through the housing wall to connect with the external heat sink, effectively nesting the heat transfer pathway within the device's existing spatial envelope rather than adding significant external volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents heat accumulation, maintaining device performance by efficiently dissipating heat generated by internal components, while also serving as a positioning mechanism and potentially providing data transmission and charging functions.
Implementation Method 1
a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device
Data Source
AI summary
An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.