Electronic Component Package with Auxiliary Pad and Solder Resist Opening
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to reduce the thickness of electronic component packages while preventing short-circuit phenomena between the auxiliary adhesive member and conductive pads, which occurs when the conductive bump thickness is reduced, leading to insufficient space for underfill and potential solder short-circuits between adjacent pads.
Innovation Solution
A circuit board design featuring an insulating layer with first and second conductive pads, an auxiliary pad with a smaller diameter, and a solder resist layer with openings, allowing for a sufficient gap between the electronic component and the insulating layer, and using a conductive adhesive member to connect the auxiliary pad and electronic component, minimizing the risk of short-circuits by positioning the component in an opening formed by removing a portion of the solder resist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the conductive bump is reduced to reduce package thickness, then the overall package thickness is reduced, but the space between the die and the circuit board becomes insufficient, making it difficult to fill underfill and increasing the risk of short-circuit between the auxiliary adhesive member and conductive pads
Solution Approach 1:
The patent divides the conductive pad structure into two parts: a first conductive pad for electrical connection and a second conductive pad (auxiliary pad) specifically for adhesive member attachment. This segmentation allows the auxiliary pad to be positioned away from the first conductive pad, preventing short-circuit between the adhesive member and the conductive pad while maintaining reduced package thickness.
Solution Approach 2:
The second conductive pad acts as an intermediary element between the auxiliary adhesive member and the first conductive pad. By introducing this intermediate structure, the patent creates spatial separation that prevents direct contact and short-circuit between the adhesive member and the conductive pad, while still enabling the adhesive member to be properly attached.
2Length of moving object
If the space between the die and the circuit board is narrowed to reduce package thickness, then the overall package thickness is reduced, but the solder is likely to short-circuit adjacent conductive pads due to spreading from pressing force and heat
Solution Approach 1:
The patent segments the conductive pad area into distinct first and second conductive pad regions with the second pad positioned away from the first pad. This spatial segmentation prevents solder from spreading from adjacent pads, as the solder resist layer and gap structure block solder flow between the separated pad regions, thereby preventing short-circuit while maintaining narrow package thickness.
Solution Approach 2:
The patent extracts the auxiliary pad function from the first conductive pad and creates a separate second conductive pad structure. This extraction allows the solder resist layer to be positioned between the first and second pads, effectively removing the harmful effect of solder spreading by creating a physical barrier that prevents solder from bridging adjacent conductive regions.
3Manufacturing precision
If the diameter of the auxiliary pad is reduced to match the smaller conductive bump, then the auxiliary adhesive member can be properly attached, but the gap between the auxiliary adhesive member and adjacent conductive pads becomes insufficient, increasing short-circuit risk
Solution Approach 1:
The patent creates a clear spatial segmentation between the first conductive pad and the second conductive pad (auxiliary pad) by positioning them in separate regions with a gap between them. This segmentation ensures that even though the auxiliary pad has a small diameter to match the conductive bump, it remains sufficiently separated from adjacent conductive pads, preventing short-circuit while maintaining proper attachment dimensions.
Solution Approach 2:
The solder resist layer acts as an intermediary barrier between the auxiliary pad and adjacent conductive pads. This intermediate layer prevents electrical contact and solder bridging, allowing the auxiliary pad to maintain its small diameter for proper bump matching while the solder resist layer provides the necessary electrical isolation to prevent short-circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design secures a sufficient gap between the electronic component and the insulating layer, preventing short-circuits and allowing for reduced overall package thickness without necessitating a thinner conductive bump, thus enhancing adhesion and reducing the risk of auxiliary adhesive member short-circuits with adjacent pads.
Implementation Method 1
a conductive adhesive member electrically connecting the auxiliary pad and the electronic component
Implementation Method 2
an auxiliary adhesive member attaching the auxiliary pad and the conductive bump to each other
Data Source
AI summary
An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.