Replaceable Auxiliary PCA Module With Self-Aligning Cooling
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Solution Overview
Problem
In electronic devices, the co-location of primary and auxiliary electronic components on the same circuit board leads to challenges in repair and replacement due to the risk of collateral damage, space constraints, and inefficient thermal management, particularly when auxiliary components like voltage regulators fail, causing heat dissipation issues and increasing service costs.
Innovation Solution
A separate, replaceable auxiliary module with a cooling component is designed to be electrically and mechanically attached to the processor PCA, allowing for relative movement and self-alignment with the cooling conduit, ensuring effective thermal contact and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If auxiliary electronic components are co-located with primary electronic components on the same circuit board, then space utilization is improved, but repair and replacement become difficult due to risk of collateral damage
Solution Approach 1:
The patent divides the electronic components into separate modules: a primary electronic component module and an auxiliary electronic component module. The auxiliary module can be independently removed and replaced without affecting the primary components, thus enabling easy repair while maintaining space-efficient design.
Solution Approach 2:
The auxiliary electronic components are extracted from the main circuit board and placed in a separate auxiliary module. This allows the auxiliary module to be independently serviced, repaired, or replaced without risking damage to the primary electronic components or the main circuit board.
2Device complexity
If auxiliary electronic components are co-located with primary electronic components on the same circuit board, then device complexity is reduced, but thermal management becomes inefficient
Solution Approach 1:
The patent segments the thermal management system into separate cooling solutions for primary and auxiliary components. The auxiliary module has its own cooling component that can be independently optimized, allowing efficient heat dissipation without complicating the overall device structure.
Solution Approach 2:
The patent applies different thermal management approaches to different parts of the system. The auxiliary module receives localized cooling tailored to its specific thermal requirements, while the primary components have their own dedicated cooling solutions, optimizing overall thermal efficiency.
3Manufacturing precision
If auxiliary electronic components are integrated on the same circuit board, then manufacturing precision requirements are reduced, but service costs increase due to collateral damage risk
Solution Approach 1:
The patent creates a modular auxiliary module that can be independently manufactured and assembled. This segmentation allows for standardized manufacturing processes with relaxed precision requirements while enabling cost-effective servicing through independent module replacement.
Solution Approach 2:
By extracting the auxiliary components into a separate module, the patent reduces the precision requirements for integrating heat-sensitive primary components with auxiliary components. The separated auxiliary module can be manufactured independently with standard precision, reducing service costs through easier replacement.
4Temperature
If a separate auxiliary module is used with cooling component, then thermal management efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the auxiliary electronic components with their dedicated cooling component into a single integrated auxiliary module. This combination improves thermal management efficiency while presenting a unified interface that simplifies integration with the main system, rather than increasing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermal management, reduces service costs by allowing for easy replacement of auxiliary modules without damaging primary components, and prevents accidental damage to internal components, while maintaining high thermal performance and signal integrity.
Implementation Method 1
a first portion configured to be thermally coupled to a cooling conduit of the electronic device
Implementation Method 2
a second portion configured to be thermally coupled to the one or more electronic components
Data Source
Figure 1A
Figure 1B~3
Figure 4A~4B
AI summary
Auxiliary module includes attachment elements, cooling component, and auxiliary PCA having a circuit board, an electrical connector, and electronic components. The attachment elements are configured to attach the auxiliary module to supporting arms protruding from the PCA such that the electrical connector is coupled to a complementary electrical connector of the PCA, and the attachment elements extend through apertures in the supporting arms. The cooling component is attached to the auxiliary PCA and includes a first portion thermally coupled to cooling conduit in an installed state of the auxiliary module and a second portion thermally coupled to the electronic components in an attached state of the cooling component to the auxiliary PCA. In an attached state of the auxiliary module to the supporting arms and a coupled state of the electrical connector with the complementary electrical connector, the auxiliary module is movable along multiple directions relative to the supporting arms.