Auxiliary Thermoelectric Cooling Plate for Rapid GPU Heat Spikes
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Solution Overview
Problem
Existing cooling systems for electronic components, such as graphics processing units, often fail to provide sufficient or responsive cooling during periods of high performance, leading to potential damage from excessive heat.
Innovation Solution
The implementation of auxiliary cooling units with thermoelectric coolers and auxiliary fluid channels, which are connected through a connection bridge to an external fluid and power system, allowing for rapid cooling responses to performance metrics of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air circulation is used to cool electronic components, then the cooling system is simple and easy to implement, but it cannot provide sufficient cooling for high-performance components that generate excessive heat
Solution Approach 1:
The cooling system is segmented into multiple independent cooling units, each capable of providing targeted cooling to specific high-heat-generation areas. Each unit includes its own cooling plate, fluid channels, and thermoelectric cooler, allowing localized cooling without requiring a complete system redesign.
Solution Approach 2:
Different parts of the cooling system have different properties: the main cooling plates use fluid circulation for general cooling, while the auxiliary cooling units use thermoelectric coolers for localized, high-intensity cooling where needed. This allows the system to provide both simple overall cooling and targeted high-performance cooling.
2Reliability
If fluid cooling plates are used to cool electronic components, then sufficient cooling is provided for high-heat components, but the system becomes more complex and requires additional components
Solution Approach 1:
The auxiliary cooling units are nested within or attached to the main cooling plate structure. The thermoelectric coolers are integrated with the fluid cooling plates, and the auxiliary fluid channels are incorporated into the existing cooling plate geometry, allowing additional cooling capacity without proportionally increasing overall system complexity.
Solution Approach 2:
The cooling plates serve multiple functions: they act as heat sinks for the electronic components, distribution channels for the cooling fluid, and mounting surfaces for the thermoelectric coolers. This multi-functionality reduces the need for separate components and simplifies the overall system architecture.
3Device complexity
If the cooling system uses fixed cooling capacity, then the system design is simple, but it cannot respond rapidly to changing performance metrics and heat generation of electronic components
Solution Approach 1:
The cooling system transitions from a fixed, static cooling capacity to a dynamic, adjustable system. The thermoelectric coolers can be independently controlled to adjust their cooling output in real-time based on the performance metrics of the electronic components, allowing rapid response to changing heat generation conditions.
Solution Approach 2:
The system incorporates feedback mechanisms where performance metrics of the electronic components are monitored and used to adjust the cooling output of the thermoelectric coolers. This closed-loop control allows the system to automatically respond to changing conditions without requiring complex external control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides rapid and targeted cooling to electronic components, preventing overheating by addressing the inefficiencies of existing cooling systems, by providing auxiliary cooling units with thermoelectric coolers and auxiliary fluid channels, ensuring safe operation during high-performance periods.
Implementation Method 1
the thermoelectric cooler has electrical connections for passing electrical current through the thermoelectric cooler to transfer heat from a cold side of the thermoelectric cooler to a hot side of the thermoelectric cooler
Implementation Method 2
the auxiliary fluid channels pass over the hot side of the thermoelectric cooler for circulating the cooling fluid to remove heat from the hot side of the thermoelectric cooler
Implementation Method 3
a main fluid cooling plate that cools an electronic component
Data Source
AI summary
An apparatus includes auxiliary cooling units coupled to a connection bridge, where each auxiliary cooling unit includes a thermoelectric cooler and auxiliary fluid channels. The connection bridge includes fluid and power connections to external fluid and power sources, and distributed the fluid and power to each auxiliary unit. The cold side of the thermoelectric cooler is positioned in thermal contact with a main fluid cooling plate that cools an electronic component and the auxiliary fluid channels pass over the hot side of the thermoelectric cooler for circulating the cooling fluid to remove heat from the hot side of the thermoelectric cooler. A method includes circulating a cooling fluid through the main fluid cooling plate to remove heat from the electronic component, monitoring a performance metric of the electronic component, and varying an amount of electrical current passing through a thermoelectric cooler responsive to the performance metric of the electronic component.