Integrated Avionics Chassis Heat Exchanger for Lightweight Cooling
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Solution Overview
Problem
Traditional heat dissipation devices for avionics in aircraft introduce significant weight, which is undesirable for efficient aircraft operation.
Innovation Solution
An electronics chassis with an integrated air-to-air heat exchanger that thermally couples to the electronic housing, utilizing a plenum and fins to dissipate heat through forced air flow, enhancing heat transfer efficiency while maintaining electrical components in a fluidly isolated environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation devices are used for avionics, then heat dissipation function is provided, but significant weight is added to the aircraft
Solution Approach 1:
The heat exchanger is integrated directly into the avionics chassis structure, merging the cooling function with the housing structure. The chassis walls themselves serve as heat transfer surfaces, eliminating the need for separate, heavy cooling components while maintaining effective heat dissipation capability.
Solution Approach 2:
The avionics chassis serves multiple functions simultaneously: it provides structural support, electromagnetic shielding, and heat dissipation. The heat exchanger integration allows the chassis to function as both a protective enclosure and an active thermal management system, reducing overall system weight by eliminating dedicated cooling components.
2Temperature
If heat exchanger is integrated into electronics chassis, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The heat exchanger channels and heat transfer surfaces are merged with the chassis walls and structural elements. This integration approach combines thermal management functionality with the existing chassis structure, improving cooling efficiency while avoiding the addition of complex, separate cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat without adding substantial weight, improving cooling efficiency by 10-20% and ensuring the electrical components are protected from contaminants and electromagnetic interference.
Implementation Method 1
utilizing a plenum and fins to dissipate heat through forced air flow
Implementation Method 2
an air-to-air heat exchanger that is thermally coupled to an electronic housing
Implementation Method 3
utilizing a plenum and fins to dissipate heat
Implementation Method 4
dissipate heat through forced air flow
Data Source
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AI summary
Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger (14, 114, 214, 314). The air-to-air heat exchanger (14, 114, 214, 314) can include an air flow inlet (48, 148, 248, 348) and various slots (50, 150, 250, 350) to establish a flow-through air path (22, 122, 222, 322).