Avionics Cooling Module With Embedded Manifold Channels
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Solution Overview
Problem
Existing power modules face efficiency losses due to heat generation, which affects their performance, and traditional thermal management methods like heat sinks can be limited by the use of thermal interface materials that may degrade, reducing system reliability and power density.
Innovation Solution
A cooling adapter with a housing and interconnected channels that allows for direct cooling of power modules without thermal interface materials, using a cooling fluid to flow through a manifold with parallel and orthogonal channels, enhancing heat dissipation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials (TIM) are used to couple the heat sink to the power module, then the heat transfer is improved, but the system reliability deteriorates due to TIM degradation over time
Solution Approach 1:
The patent removes the thermal interface material (TIM) from the thermal management system. Instead of using TIM to couple the heat sink to the power module, the invention uses a heat sink with embedded channels that directly contact the power module base, eliminating the degradable intermediate layer while maintaining thermal coupling
Solution Approach 2:
The patent introduces a thermal adhesive layer as a permanent bonding intermediary between the power module base and the heat sink. This thermal adhesive provides both mechanical attachment and thermal conduction without the degradation issues of traditional TIM, serving as a reliable mediator that maintains both thermal performance and system reliability
2Power
If the power module footprint is reduced to increase power density, then the power density is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation (traditional heat sink surfaces) to three-dimensional heat dissipation by embedding cooling channels within the heat sink structure. This allows heat to be removed from multiple dimensions simultaneously, maintaining effective heat dissipation even when the power module footprint is reduced
Solution Approach 2:
The patent embeds cooling channels within the heat sink structure itself, creating a nested configuration where the channels are integrated into the heat sink body. This nested design allows the cooling functionality to be contained within the heat sink volume, enabling effective heat dissipation without increasing the overall footprint
3Ease of manufacture
If traditional heat sinks with TIM are used for thermal management, then the manufacturing process is simple, but the long-term thermal performance deteriorates due to TIM degradation
Solution Approach 1:
The patent eliminates the separate TIM application step from the manufacturing process. By integrating the thermal adhesive layer as a permanent bonding component during heat sink assembly, the design removes the need for ongoing TIM maintenance and replacement, thereby extending the operational duration of effective thermal performance
Solution Approach 2:
The patent employs a composite structure combining the heat sink material (metal) with a thermal adhesive layer that provides both mechanical bonding and thermal conduction. This composite approach creates a durable, long-lasting thermal management solution that maintains performance over extended periods without the degradation issues of traditional TIM
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases the heat transfer coefficient, reduces thermal resistivity by 30-40%, and allows for increased current ratings, while also providing interchangeability and cost benefits by attaching to pre-existing power modules without the need for full replacement.
Implementation Method 1
transferring the heat away from the heat source of the power module
Implementation Method 2
A cooling medium such as water is passed through the tubes to cool the power module
Data Source
AI summary
An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.