Avionics Power Management Panel Door Assembly Crimped Profile

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Modern aircraft power management panels become large and heavy due to increased components and wiring, leading to weight and cost issues, and require improved strength-to-weight characteristics and thermal management.

Innovation Solution

A door assembly for avionics power management panels with a crimped profile front panel and frame design that supports circuit breakers and printed circuit boards, providing structural, thermal, and access benefits, reducing the need for wiring and enhancing component mounting capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If increased components and wiring are added to power management panels to meet modern aircraft requirements, then functional capability is improved, but weight and device complexity worsen

Engineering Contradiction:
Improvefunctional capabilityVSAvoidpanel weight
Core Design Contradiction:
Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent integrates circuit breakers, printed circuit boards, and electrical relays directly into the door assembly structure, merging multiple functional components into a single integrated unit. This consolidation reduces the need for separate mounting structures and wiring harnesses, thereby decreasing overall weight while maintaining full functional capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The door assembly is designed to serve multiple functions simultaneously: it provides structural support, acts as a mounting platform for electrical components, serves as a thermal management surface, and functions as an access door. This multi-functionality eliminates the need for separate dedicated structures for each function, reducing overall system weight and complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If more components are integrated into the power management panel, then functional capability is improved, but device complexity increases

Engineering Contradiction:
Improvefunctional capabilityVSAvoidpanel complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple electrical components are integrated into the door assembly, which consolidates what would otherwise be separate mounting structures, wiring harnesses, and support elements into a single unified component. This merging reduces device complexity by eliminating redundant structural elements.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The door assembly is designed as a modular unit that can be independently manufactured, tested, and installed. This segmentation allows for simplified manufacturing and assembly processes, reducing overall device complexity despite the high integration of functional components within the module.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If traditional mounting structures are used for circuit breakers and PCBs, then ease of manufacture is maintained, but weight increases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidpanel weight
Core Design Contradiction:
Ease of manufactureVSWeight of moving object

Solution Approach 1:

The mounting structures for circuit breakers and PCBs are integrated directly into the door assembly fabrications, eliminating the need for separate mounting brackets and fastening systems. This integration maintains manufacturing simplicity while significantly reducing the weight associated with redundant structural components.

Inventive Principle:
Principle #5Merging (Combining)

4Power

If compact high-density interface system is implemented, then power-to-volume ratio is improved, but thermal management challenges increase

Engineering Contradiction:
Improvepower-to-volume ratioVSAvoidthermal dissipation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The door assembly integrates thermal management functionality directly with the component mounting structure, combining heat dissipation surfaces with the structural support elements. This integration allows for efficient thermal pathways from high-power components without requiring separate thermal management systems.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for a compact, high-density interface system with improved thermal dissipation and reduced weight, enhancing the power-to-volume and power-to-weight ratios while providing quick access and environmental protection for electrical components.

Implementation Method 1

the set of rows have a crimped profile with a ridge extending towards a front surface of the door assembly wherein the door assembly is configured to support circuit breakers, printed circuit boards, or electrical relays

Methodology Applied
Scientific EffectCrimped profile structural support:

Data Source

PatentUS11081867B2Avionics power management panel and door assembly
Publication Date: 2021.08.03 GE AVIATION SYST LTD
  • US11081867B2 patent drawing
  • US11081867B2 patent drawing
  • US11081867B2 patent drawing

AI summary

An avionics power management panel and door assembly where the panel includes a cabinet including a set of walls at least partially defining an interior with an open face and door assembly includes a central panel a front panel that includes a set of rows with apertures formed between two adjacent rows and where the set of rows have a crimped profile.