Multi-Filter AWR Die Integration for EMI Shielding and Heat Spreading
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Solution Overview
Problem
Legacy RF front-end solutions utilize multiple discrete acoustic wave resonator dies for different bandwidths, leading to increased form factor, higher layer counts, and insufficient thermal management due to wire-bond interconnects, which result in larger size, higher manufacturing costs, and inadequate heat extraction.
Innovation Solution
Integration of multiple filters on a single AWR die with metal layers and vias for EMI shielding, along with a lid element, and the use of flip-chip dies to reduce the number of packaging layers and interconnect losses, enhancing thermal performance through a top-side heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple discrete acoustic wave resonator dies are used for different bandwidths, then each filter can be optimized for its specific bandwidth, but the form factor increases and the number of packaging layers increases
Solution Approach 1:
The patent combines multiple acoustic wave resonator filters with different bandwidths onto a single die. The die includes a first filter with a first bandwidth and a second filter with a second bandwidth, eliminating the need for multiple discrete dies and reducing the overall form factor while maintaining individual filter optimization.
Solution Approach 2:
The single die is designed to perform multiple filter functions simultaneously. It includes different types of acoustic wave resonators (e.g., bulk acoustic wave resonators and surface acoustic wave resonators) that can handle different bandwidth requirements, making the die universal for multiple filtering applications.
2Ease of manufacture
If wire-bond interconnects are used for connecting discrete dies, then the implementation is straightforward, but thermal management becomes insufficient and heat extraction is inadequate
Solution Approach 1:
The patent replaces wire-bond mechanical interconnects with metal layers and vias integrated into the die structure. This substitution provides both electrical interconnection and thermal conduction pathways, enabling effective heat extraction from the die while maintaining ease of manufacture through standard semiconductor fabrication processes.
3Reliability
If multiple discrete dies are used, then each die can be independently optimized, but manufacturing costs increase
Solution Approach 1:
The patent merges multiple filter functions into a single die, reducing the total number of dies that need to be manufactured, packaged, and assembled. This consolidation decreases manufacturing complexity and cost while maintaining the ability to optimize each filter's performance through dedicated resonator structures.
4Reliability
If discrete acoustic wave resonator dies are used, then filter specificity is maintained, but the height of the RF SiP increases
Solution Approach 1:
The patent integrates multiple filters with different bandwidths onto a single die, eliminating the need for stacking multiple discrete dies vertically. This integration maintains filter specificity through dedicated resonator structures while reducing the overall height of the RF SiP by consolidating the filter functions in a single planar structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the overall size and height of the RF SiP, improves EMI shielding, and enhances thermal performance by integrating multiple filters on a single die and using flip-chip technology for better heat management.
Implementation Method 1
metal layers and vias for EMI shielding, along with a lid element
Implementation Method 2
enhancing thermal performance through a top-side heat spreader
Data Source
AI summary
Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.