Integrated AWR Filter Die With EMI Shielding and Lower Package Height
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Legacy RF front-end solutions utilize multiple discrete acoustic wave resonator dies for different bandwidths, leading to increased form factor, higher layer counts, and insufficient thermal management due to discrete die-to-die spacing and wire-bond interconnects, which result in higher manufacturing costs and limited EMI shielding.
Innovation Solution
Integration of multiple filters on a single AWR die with metal layers and vias for EMI shielding, along with a lid element, and the use of flip-chip dies to reduce the number of packaging layers and interconnect losses, enhancing thermal performance through a top-side heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple discrete acoustic wave resonator dies are used for different bandwidths, then each filter can be optimized for specific bandwidth requirements, but the overall form factor increases and the number of packaging layers increases
Solution Approach 1:
The patent combines multiple acoustic wave resonator filters with different bandwidths onto a single die substrate. The first filter with first bandwidth and second filter with second bandwidth are integrated on the same die, eliminating the need for multiple discrete dies and reducing the overall form factor while maintaining bandwidth-specific optimization.
Solution Approach 2:
The single die substrate is designed to host multiple filters with different bandwidth characteristics, making it a multi-functional component. This universal approach allows one die to replace multiple specialized dies, reducing packaging complexity and interconnect requirements.
2Adaptability or versatility
If multiple discrete acoustic wave resonator dies are used for different bandwidths, then each filter can be optimized for specific bandwidth requirements, but the number of packaging layers increases
Solution Approach 1:
The patent merges multiple filters onto a single die, which directly reduces the number of packaging layers required. By integrating the first filter and second filter on the same die substrate, the patent eliminates the need for stacking multiple dies, thereby simplifying the packaging structure.
3Ease of manufacture
If discrete die-to-die spacing and wire-bond interconnects are used, then multiple discrete dies can be connected, but thermal management becomes insufficient and manufacturing costs increase
Solution Approach 1:
The patent combines multiple filters on a single die, which eliminates die-to-die spacing requirements and wire-bond interconnects. This integration improves thermal management by allowing direct thermal coupling between filters and the substrate, enabling more efficient heat dissipation without the thermal barriers introduced by discrete mounting and wire bonds.
4Adaptability or versatility
If multiple discrete acoustic wave resonator dies are used, then different bandwidths can be implemented, but EMI shielding is limited
Solution Approach 1:
The patent integrates multiple filters on a single die with inherent EMI shielding structures. The close integration allows for shared shielding resources and reduced electromagnetic interference between filters, as they are confined to a smaller area with controlled impedance paths, improving EMI shielding effectiveness compared to discrete die arrangements.
Data Source
AI summary
Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.