Axial Diode Junction Box With Flattened Pins for High-Current Heat Dissipation
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Solution Overview
Problem
The existing technologies face challenges in efficiently dissipating heat from diodes in photovoltaic junction boxes, particularly for high-current applications, leading to complex and costly production processes for modular diodes, which are often required to replace axial diodes.
Innovation Solution
An axial diode junction box design that includes an axial diode with first and second pins, where the pins are flattened to serve as direct welding surfaces, reducing the need for extra connection members and enhancing heat dissipation by increasing the welding area and shortening heat dissipation paths, allowing for efficient heat management and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If modular diodes are used to satisfy high current requirements, then the current handling capability is improved, but the production cost and device complexity increase significantly
Solution Approach 1:
The patent modifies the physical parameters of the axial diode by flattening its pins to create larger welding surfaces. This parameter change enables the diode to handle high currents (20A-35A) while maintaining the simple axial diode structure, avoiding the need for complex modular diode assemblies.
Solution Approach 2:
The patent separates the heat dissipation function from the electrical connection function by creating distinct flat welding surfaces on the pins. The flattened pin structure provides both electrical connectivity and thermal management interfaces, simplifying the overall design while handling high currents.
2Power
If modular diodes are used for high current applications, then the current capacity is improved, but the production cost increases due to additional packaging and testing equipment
Solution Approach 1:
The axial diode's flattened pins serve multiple functions simultaneously: electrical connection, mechanical mounting, and heat dissipation. This self-service design eliminates the need for separate packaging and testing equipment required by modular diodes, reducing production costs while maintaining high current capacity.
Solution Approach 2:
The patent combines the electrical conductor and heat dissipation path into a single integrated structure—the flattened pin. This merging of functions reduces the number of components and simplifies the manufacturing process, lowering production costs compared to modular diode systems.
3Ease of manufacture
If conventional axial diodes are used, then the production cost is low and mounting is simple, but heat dissipation efficiency is insufficient for high current applications
Solution Approach 1:
The patent transitions the pin from a conventional cylindrical shape to a flattened geometry, adding a dimensional change that increases the surface area. This dimensional modification enhances heat dissipation efficiency while maintaining the cost-effective axial diode manufacturing approach.
Solution Approach 2:
The pin is flattened specifically at the regions where heat dissipation and electrical connection are needed, while the rest of the diode structure remains unchanged. This localized modification optimizes heat dissipation efficiency without requiring complete redesign of the entire diode, keeping production costs low.
4Power
If modular diodes are used to handle high currents, then the current rating is improved, but the mounting process becomes more complex and time-consuming
Solution Approach 1:
The patent extracts the heat dissipation and electrical connection functions from separate components and integrates them directly into the axial diode's pin structure. This extraction eliminates the need for additional mounting hardware and steps required by modular diodes, improving mounting efficiency while maintaining high current rating.
Solution Approach 2:
The pins are pre-flattened during the diode manufacturing process, preparing the welding surfaces in advance. This preliminary action eliminates the need for additional on-site preparation or complex mounting procedures, streamlining the installation process for high-current applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The axial diode junction box effectively manages heat dissipation for high currents (20 A-35 A), simplifies the mounting process, reduces production costs, and improves power utilization by eliminating the need for modular diodes, thereby enhancing product reliability and production efficiency.
Implementation Method 1
The first flat portion and the second flat portion can increase heat dissipation areas of the axial diode and shorten heat dissipation paths (e.g., an original heat dissipation path from the pin to the conductive sheet is shortened to a direct heat dissipation by the pin), improve a heat dissipation effect
Data Source
AI summary
The present application discloses an axial diode junction box and a method for manufacturing the same, comprising an axial diode and a junction box body, wherein the axial diode is mounted inside the junction box body; the axial diode comprises a diode body, a first pin, and a second pin, one end of the diode body is connected to the first pin, the other end of the diode body is connected to the second pin, and a direction where the diode body is close to the junction box body is defined as a front direction; the first pin comprises a first connection portion and a first flat portion, one end of the first connection portion is connected to one end of the diode body, and the other end of the first connection portion is connected to the first flat portion; the second pin comprises a second connection portion and a second flat portion, one end of the second connection portion is connected to the other end of the diode body, and the other end of the second connection portion is connected to the second flat portion; and the diode body is clamped to the junction box body. The present application can simplify a production process, reduce a product cost, improve the product reliability, and improve the production efficiency of a production line.


