Axial LED Orientation via Modular Subassembly

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Solution Overview

Problem

The placement of LEDs directly on a PCB limits design flexibility and thermal management due to constrained PCB sizing and airflow, particularly in devices requiring multiple LEDs for adequate brightness and uniformity.

Innovation Solution

A three-component LED subassembly comprising an LED module, light tube, and lightguide allows for axial orientation of LEDs, decoupling them from the PCB, enabling flexible design and improved airflow for thermal management by maximizing light transmittance and uniformity through a modular system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If LEDs are placed directly on a PCB, then the PCB structure is simplified, but design flexibility and thermal management are limited

Engineering Contradiction:
ImprovePCB structureVSAvoiddesign flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The LED assembly is segmented into separate components: LEDs mounted on a dedicated PCB, a light tube, and a lightguide. This segmentation allows each component to be optimized independently - the PCB for electrical connections, the light tube for optical performance, and the lightguide for light distribution - while providing design flexibility in how these components are arranged in the final device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The LEDs are extracted from the main PCB and mounted on a separate dedicated PCB. This extraction removes the thermal and spatial constraints of the main PCB, allowing the LEDs to be positioned optimally for thermal management and optical performance while the main PCB can be designed independently for its electrical and structural functions.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of manufacture

If LEDs are placed directly on a PCB, then assembly is simplified, but airflow for thermal management is restricted

Engineering Contradiction:
ImproveassemblyVSAvoidthermal management
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

By segmenting the LED assembly into separate components mounted on a dedicated PCB, the design creates dedicated airflow paths between the LEDs and the housing. This segmentation allows airflow to be optimized for thermal management without complicating the overall assembly process, as the modular components can be pre-assembled and then integrated into the final device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The separation of LEDs from the main PCB allows the system to utilize three-dimensional space for thermal management. Airflow can be directed through dedicated paths in the housing, and the LEDs can be positioned at optimal distances and orientations, transforming the thermal management problem from a two-dimensional PCB surface issue to a three-dimensional spatial optimization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Illumination intensity

If multiple LEDs are used for brightness and uniformity, then illumination quality improves, but PCB routing complexity increases

Engineering Contradiction:
Improvebrightness and uniformityVSAvoidPCB routing
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

Multiple LEDs are mounted on a dedicated PCB rather than being routed across the main PCB. This segmentation allows the dedicated PCB to be designed specifically for LED mounting with optimized routing for each LED, while the main PCB remains simple for its electrical and structural functions. The dedicated PCB acts as an intermediate layer that simplifies the overall system architecture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The dedicated PCB serves as an intermediary between the LED array and the main PCB. It provides a dedicated mounting surface and routing layer for the LEDs, isolating the complexity of multiple LED connections from the main PCB design. This intermediary layer allows the main PCB to maintain simplicity while supporting multiple LEDs for improved illumination quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances design flexibility and thermal management by ensuring consistent light distribution and optimal airflow, addressing the limitations of traditional PCB-based LED placement.

Implementation Method 1

a lightguide to transmit the light

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS11732867B2Axial orientation of LEDs
Publication Date: 2023.08.22 ARRIS ENTERPRISES LLC
  • US11732867B2 patent drawing
  • US11732867B2 patent drawing
  • US11732867B2 patent drawing

AI summary

Methods, systems, and computer readable media can be operable to facilitate an improved positioning of one of more LEDs on a device. A CPE (customer premise equipment) device may include a three-component subassembly composed of an LED module, light tube, and lightguide to allow for uniform lighting with design flexibility. The modularity of the design allows for decoupling from the PCB and reduces the design constraints.