Azole Cleaning Agent for Copper-Resin Adhesion in Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face issues with peeling between a molded resin and a copper frame due to thermal stress, oxidation, and chemical treatment, which compromises their reliability.
Innovation Solution
A cleaning agent containing an azole-based compound with functional groups like glycidyl, hydrolyzable silyl, and amino groups is used to clean the copper surfaces, removing impurities and preventing oxidation, thereby enhancing adhesion to the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper is used as frame material for good thermal conduction, then thermal conduction is improved, but peeling occurs at the joining interface between copper and molded resin due to oxidation and contamination
Solution Approach 1:
The patent introduces an azole-based compound as an intermediary substance between copper and molded resin. This compound forms a protective film on the copper surface that prevents oxidation and contamination while maintaining good thermal conduction. The azole-based compound acts as a mediator that allows both thermal transfer and adhesion to resin simultaneously, resolving the contradiction between thermal conduction and interface stability.
Solution Approach 2:
The patent creates a composite structure consisting of copper frame, azole-based compound film, and molded resin. This multi-layer composite material system combines the thermal conduction advantage of copper with the protective and adhesive properties of the azole-based compound, eliminating peeling at the joining interface while maintaining excellent thermal performance.
2Object-affected harmful factors
If a thick oxide film is formed on copper surface, then oxidation protection is improved, but peeling is accelerated by internal destruction
Solution Approach 1:
The patent changes the chemical composition and thickness parameters of the oxide film by introducing an azole-based compound. Instead of allowing a thick natural oxide film to form, the azole-based compound creates a thin, controlled protective film with optimal thickness and composition. This film provides sufficient oxidation protection while preventing internal destruction that would cause peeling, thus resolving the contradiction between oxidation protection and peeling resistance.
3Reliability
If chemical treatment is applied to copper surface, then adhesion to resin is improved, but contamination occurs and reliability decreases
Solution Approach 1:
The patent replaces traditional mechanical or harsh chemical surface treatment methods with a chemical vapor deposition approach using azole-based compound. This compound vapor deposits onto the copper surface to form a protective film that inherently provides good adhesion to resin without requiring aggressive surface treatments. The azole-based compound system substitutes harmful mechanical/chemical treatments with a cleaner, more controlled deposition process that maintains adhesion while avoiding contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning agent effectively suppresses surface oxidation and discoloration, improving the adhesion between copper components and the resin, thus preventing peeling and ensuring high reliability of semiconductor devices.
Implementation Method 1
The cleaning agent includes an azole-based compound having a group including at least one selected from the group consisting of a glycidyl group, a hydrolyzable silyl group, and an amino group... suppresses oxidation of the surface to suppress discoloration of the surface
Implementation Method 2
cleaning the conductor and the semiconductor chip with the cleaning agent... removing impurities and preventing oxidation
Implementation Method 3
The cleaning agent includes an azole-based compound having a group including at least one selected from the group consisting of a glycidyl group, a hydrolyzable silyl group, and an amino group... improving the adhesion between copper components and the resin
Data Source
AI summary
According to one embodiment, there is provided a cleaning agent. The cleaning agent includes an azole-based compound having a group including at least one selected from the group consisting of a glycidyl group, a hydrolyzable silyl group, and an amino group.