Back Bezel Assembly with Segmented Thermal Conductivity

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Solution Overview

Problem

Conventional back bezel assemblies in LCD backlight modules suffer from heat concentration due to overlapping components, leading to performance degradation and increased weight, which complicates heat dissipation and material usage.

Innovation Solution

A back bezel assembly comprising a first board with high thermal conductivity and a second board with lower thermal conductivity, where the second board isolates heat from the light source device and directs it away, ensuring uniform heat dissipation and reducing material usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the back bezel is integrally formed by stamping metallic material to improve heat dissipation, then heat dissipation capability is improved, but heat concentration occurs in local areas due to overlapping components

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidheat concentration

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The back bezel is divided into multiple sections with different thermal conductivity characteristics. The first region (first back bezel) has higher thermal conductivity for general heat dissipation, while the second region (second back bezel) has lower thermal conductivity to isolate heat from the inverter. This segmentation prevents heat concentration in local areas while maintaining overall heat dissipation capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the back bezel are assigned different thermal conductivity properties according to their specific functional requirements. The first region uses high thermal conductivity material for effective heat dissipation from the light source device, while the second region uses low thermal conductivity material to protect the inverter from heat. This local quality differentiation resolves the contradiction between heat dissipation and heat concentration.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If overlapping configuration of inverter and light source device is used, then space utilization is improved, but heat concentration and component failure risk increase

Engineering Contradiction:

Improvespace utilizationVSAvoidcomponent operation reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The back bezel is designed with spatially varying thermal conductivity: the first region provides efficient heat conduction away from the light source device, while the second region provides thermal insulation to protect the inverter. This allows overlapping configuration for compactness while maintaining component reliability through localized thermal management.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The second back bezel region acts as a thermal intermediary or buffer between the light source device and the inverter. It allows the components to be positioned in overlapping configuration for space efficiency while mediating the thermal interaction by blocking heat transfer to the inverter, thus preserving reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If insulation pad is placed between back bezel and inverter, then heat isolation is improved, but material usage and overall weight increase

Engineering Contradiction:

Improveheat isolationVSAvoidoverall weight

Core Design Contradiction:

Object-affected harmful factorsVSWeight of stationary object

Solution Approach 1:

The insulating function previously performed by a separate insulation pad is merged into the back bezel structure itself. The second region of the back bezel is formed with low thermal conductivity material that provides both structural support and thermal insulation, eliminating the need for additional insulation components and reducing overall weight.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The back bezel is designed to serve multiple functions: the first region provides heat dissipation pathways, the second region provides thermal insulation, and the entire structure provides mechanical support. This multi-functionality eliminates the need for separate insulation pads, reducing material usage and weight while maintaining heat isolation effectiveness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prevents heat concentration, ensures normal operation of the inverter and light source, reduces weight, and lowers the profile of the backlight module, thereby enhancing its competitiveness and efficiency.

Implementation Method 1

the first board having a thermal conductivity greater than that of the second board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7852427B2Back bezel assembly for a backlight module

Publication Date: 2010.12.14 AU OPTRONICS CORP

AI summary

A back bezel assembly for a backlight module is provided. The back bezel comprises a first board and a second board, which are assembled at the edges thereof to form a continuous board. The thermal conductivity of the second board is less than that of the first board. A light source and an inverter are disposed at the opposite sides with respect to the second board, so the second board isolates the heat, generated from the light source device, from being conducted toward the inverter.