Back-Bias Magnet Shaped Contact Surface for Sensor Alignment
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Solution Overview
Problem
Conventional magnetic field sensors with back-bias magnets face challenges in achieving precise and reproducible magnetic field orientation, leading to difficulties in setting the desired magnetic field direction, especially for GMR sensors, due to complex and expensive multi-pole magnetic gear wheels and imprecise positioning.
Innovation Solution
A back-bias magnet apparatus with a semiconductor chip element, where the contact surface of the back-bias magnet is shaped to correspond with the structures on the semiconductor chip element, allowing for exact positioning and reproducible magnetic field setting, using methods like etching and magnetizable injection material for cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional back-bias magnets with flat contact surfaces are used, then the device complexity is low and ease of manufacture is high, but the manufacturing precision and reliability of magnetic field orientation are insufficient
Solution Approach 1:
The contact surface of the back-bias magnet is equipped with localized structures (protrusions or recesses) that correspond to complementary structures on the semiconductor chip element. This local structural differentiation enables precise positioning and reproducible magnetic field orientation without requiring complex overall device design, thereby resolving the contradiction between manufacturing precision and device complexity.
2Manufacturing precision
If multi-pole magnetic gear wheels are used to achieve desired magnetic field direction, then the magnetic field orientation can be controlled, but the device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the magnetic field direction control function from the complex multi-pole magnetic gear wheel system and integrates it directly into the back-bias magnet structure through specially designed contact surface geometries. This eliminates the need for separate magnetic gear wheels while maintaining the ability to control magnetic field orientation, thereby reducing device complexity and manufacturing cost while preserving the desired level of precision.
3Reliability
If the chip sensor is positioned between a permanent magnet and a movable component, then the sensor can measure magnetic field changes, but the magnetic field penetration direction cannot be precisely controlled
Solution Approach 1:
The back-bias magnet and semiconductor chip element are provided with complementary structures on their contact surfaces before assembly. These pre-configured structures ensure that when the components are brought together, the magnetic field penetration direction is automatically aligned with the sensor's sensitive axis, enabling both reliable measurement and precise directional control without requiring additional positioning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of magnetic field sensors with reproducible magnetic field settings, reducing fabrication-related fluctuations and increasing measurement accuracy and sensitivity, while being cost-effective and adaptable to various magnetic field measurement requirements.
Implementation Method 1
a back-bias magnet (700); and a semiconductor chip element (100), wherein the semiconductor chip element has a sensor (200) for measuring a magnetic field strength
Data Source
AI summary
An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.