Back-Contact Back-Sheet Encapsulant Alignment via Local Laser Fixation
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Solution Overview
Problem
The expansion and contraction of the lower encapsulating layer during the lamination process in photovoltaic module production cause misalignment of through-holes with contact points, leading to potential electrical contact issues in back-contact solar cell modules.
Innovation Solution
Inducing adhesion between predetermined portions of the lower encapsulating layer and the inner surface of the back-contact back-sheet using laser heating or infrared radiation before lamination, ensuring correct alignment and reducing movement during the lamination phase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lower encapsulating layer is applied to the back-contact back-sheet before lamination, then the alignment of through-holes with contact points can be maintained, but the encapsulating layer expands and contracts during heating causing misalignment
Solution Approach 1:
The encapsulating layer is fixed to the back-contact back-sheet before the lamination process using laser heating or infrared radiation. This preliminary fixation action ensures that the layer remains stable and maintains alignment during subsequent heating, preventing misalignment of through-holes with contact points while allowing controlled air passage to prevent bubble formation
Solution Approach 2:
The fixation is applied locally at predetermined portions rather than uniformly across the entire encapsulating layer. This selective local fixation allows the layer to maintain alignment where needed while still permitting air passage in other areas to prevent bubble formation during lamination
2Manufacturing precision
If the encapsulating layer is fixed completely to prevent movement, then alignment is maintained, but air cannot pass through causing bubble formation
Solution Approach 1:
The fixation is applied selectively at predetermined portions of the encapsulating layer rather than uniformly across the entire surface. This local fixation approach maintains alignment where fixation is applied while leaving other areas open for air passage, thus preventing bubble formation during the lamination process
Solution Approach 2:
Instead of complete fixation across the entire encapsulating layer, only partial fixation at specific predetermined portions is applied. This partial action is sufficient to maintain alignment while allowing air to pass through unfixed areas to prevent bubble formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method maintains the correct alignment of through-holes with contact points, preventing misalignment and ensuring reliable electrical contact, while allowing air passage to prevent bubble formation and reducing the risk of trapped air during lamination.
Implementation Method 1
Inducing adhesion between predetermined portions of the lower encapsulating layer and the inner surface of the back-contact back-sheet using laser heating or infrared radiation before lamination
Implementation Method 2
Inducing adhesion between predetermined portions of the lower encapsulating layer and the inner surface of the back-contact back-sheet using laser heating or infrared radiation before lamination
Data Source
AI summary
A method for the production of a photovoltaic module comprising back-contact solar cells. A lower encapsulating layer, followed by an alignment and an application of the lower encapsulating layer to the inner surface of the back-contact back-sheet. The lower encapsulating layer, comprises a lower surface facing the back-contact back-sheet and an upper surface opposite the lower surface. The method includes adhesion of one or more predetermined portions of the lower surface of the encapsulating layer to the back-contact back-sheet, having each portion a predetermined superficial area which is lower than the total area of the lower surface of the lower encapsulating layer. The adhesion of the lower encapsulating layer is followed by the application of the lower encapsulating layer to the back-contact back-sheet.