Back-Contact Back-Sheet Milling for PV Module Circuit Formation

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Solution Overview

Problem

Traditional methods for producing back-contact back-sheets in photovoltaic modules face challenges such as deformation due to high temperatures during chemical etching, leading to a less flat and less reliable product, which compromises the quality and stability of the module assembly.

Innovation Solution

A method using mechanical ablation or milling at low temperatures to form the connecting circuit on the back-contact back-sheet, allowing precise control and avoiding excessive heating, which maintains the flatness and quality of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If chemical etching is used to form the connecting circuit, then the circuit can be formed on the back-sheet, but substrate deformation occurs due to high temperature

Engineering Contradiction:

Improvecircuit formation capabilityVSAvoidsubstrate flatness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the chemical etching process with a mechanical milling process to form the connecting circuit on the back-sheet. This substitution eliminates the high temperature exposure that causes substrate deformation while maintaining the ability to create precise circuit patterns through controlled mechanical removal of material.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing parameters from high temperature chemical etching to low temperature mechanical milling. This parameter change allows the circuit to be formed without exposing the substrate to temperatures that would cause deformation, thereby maintaining substrate flatness while achieving circuit formation.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If chemical etching is used to form the connecting circuit, then the circuit can be formed, but excessive heating occurs causing quality degradation

Engineering Contradiction:

Improvecircuit formation capabilityVSAvoidthermal damage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the thermal chemical etching process with a mechanical milling process. This substitution eliminates the harmful thermal effects that degrade material quality while preserving the functionality of circuit formation through mechanical material removal.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If traditional back-sheet structure is used, then electrical insulation is provided, but connecting circuit access to outer surface is blocked

Engineering Contradiction:

Improveelectrical insulationVSAvoidcircuit accessibility

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent segments the back-sheet structure by creating through-holes that penetrate the insulating substrate. This segmentation allows the connecting circuit to be accessed from the outer surface while the bulk of the substrate maintains its electrical insulation function, thus resolving the contradiction between insulation and accessibility.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces through-holes as intermediary structures that enable electrical connection to pass through the insulating substrate. These holes act as mediators that allow the connecting circuit to access the outer surface while the surrounding insulating material continues to provide electrical isolation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of a precise and efficient connecting circuit without causing substrate deformation, ensuring a stable and reliable assembly of photovoltaic modules by maintaining the flatness and quality of the back-contact back-sheet.

Implementation Method 1

a mechanical ablation is performed, for example by milling, with the aim of forming the connecting circuit on the inner surface of the back-contact back-sheet

Methodology Applied

Scientific EffectMechanical ablation: Abrasion

Data Source

PatentUS10103283B2Method of production of back-contact back-sheet for photovoltaic modules

Publication Date: 2018.10.16 EBFOIL

AI summary

The present invention provides a method for producing a back-contact back-sheet for a photovoltaic module comprising back-contact cells. The method comprising providing a substrate (210) having an outer surface (210os) facing the air-side of the photovoltaic module and an inner surface (210is) opposite the outer surface (210os) and facing the inside of the photovoltaic module. A layer of electrically conductive material (220) adapted to be formed as a connecting circuit (220c) to the electrodes of the solar cells is then applied to the substrate (210). The application of the layer of electrically conductive material (220) to the substrate (210) is performed in such a way that the layer of electrically conductive material (220) fixedly adheres to the inner surface (210is) of the substrate (210). The layer of electrically conductive material (220) is then processed so as to form the connecting circuit (220c). The step of processing the layer of electrically conductive material (220) comprises mechanically milling the layer of electrically conductive material (220), the processing being performed after the application of the layer of electrically conductive material (220) to the substrate (210).