Multi-layered Back-sheet for Back-contact PV Modules
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Solution Overview
Problem
The production of photovoltaic modules with back-contact cells is hindered by the complexity and cost of piercing and aligning encapsulating material layers with high precision, leading to inefficiencies and increased production costs due to the need for precise alignment and stability during assembly.
Innovation Solution
A multi-layered structure comprising a dielectric material layer and an encapsulating material layer, with a thermo-adhesive resin, is applied to the back-contact back-sheet to enhance stability and precision, allowing for pre-perforation and alignment simplification, reducing the need for precise alignment and piercing during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If encapsulating material layers are pierced and aligned with high precision during assembly, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The encapsulating material layer is pre-perforated with through-holes at the correct positions before assembly, and the back-sheet is pre-marked with alignment marks indicating where conductive paste should be applied. This preliminary preparation eliminates the need for complex real-time alignment and piercing operations during assembly, thereby reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The assembly process is segmented into distinct preparation and assembly phases. The encapsulating layer is prepared separately with pre-defined through-holes, and the back-sheet is prepared separately with alignment marks. This segmentation allows each component to be optimized independently, reducing the overall complexity of the assembly process while ensuring precise alignment when components are combined.
2Reliability
If encapsulating material layers are pierced during assembly, then electrical connection is enabled, but production time and cost increase
Solution Approach 1:
The through-holes are pre-formed in the encapsulating material layer before assembly, eliminating the need for time-consuming piercing operations during the assembly process. This preliminary action maintains the reliability of electrical connections while significantly improving productivity by reducing assembly time.
Solution Approach 2:
Instead of piercing the encapsulating layer during assembly to create through-holes, the approach is inverted by pre-forming the through-holes in the encapsulating layer before assembly. This inversion of the process sequence eliminates the need for complex piercing equipment and operations during assembly, thereby improving productivity while ensuring reliable electrical connections.
3Manufacturing precision
If precise alignment is required during assembly, then manufacturing precision is improved, but loss of time and increased waste occur
Solution Approach 1:
Alignment marks are pre-marked on the back-sheet indicating the exact positions where conductive paste should be applied and where through-holes should be positioned. This preliminary marking eliminates the need for time-consuming alignment measurements and adjustments during assembly, thereby maintaining manufacturing precision while reducing assembly time.
Solution Approach 2:
The pre-marked alignment marks on the back-sheet serve as self-guiding features that automatically indicate the correct positioning of the encapsulating layer and conductive paste application. This self-service alignment mechanism eliminates the need for complex alignment tools and procedures, reducing both assembly time and the risk of misalignment waste.
4Reliability
If complex piercing and alignment tasks are performed during assembly, then electrical connection reliability is improved, but production cost increases
Solution Approach 1:
The through-holes and alignment marks are prepared in advance before assembly, simplifying the manufacturing process by eliminating complex real-time piercing and alignment operations. This preliminary preparation maintains electrical connection reliability while significantly improving ease of manufacture by reducing the complexity of assembly operations.
Solution Approach 2:
The alignment marks on the back-sheet serve as an intermediary guide that mediates between the encapsulating layer and the conductive paste application. This intermediary marking system simplifies the manufacturing process by providing a clear reference for positioning, thereby improving ease of manufacture while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and speeds up the assembly process, improves precision, reduces waste, and minimizes risks of conductive paste contamination, while eliminating the need for complex piercing and alignment tasks, thereby making the production of photovoltaic modules more efficient and cost-effective.
Implementation Method 1
The chemical or physical treatment of the upper surface of the dielectric material layer comprises a corona treatment or a plasma treatment
Implementation Method 2
The chemical or physical treatment of the upper surface of the dielectric material layer comprises a corona treatment or a plasma treatment
Implementation Method 3
a layer of a thermo-adhesive resin is applied to the surface of the dielectric material opposite the surface onto which the encapsulating material layer is fixed, so as to allow the dielectric material layer to steadily adhere to the surface of the back-contact back-sheet
Data Source
AI summary
The present invention provides for a multi-layered structure adapted to be applied to the surface of a back-contact back-sheet for a photovoltaic module comprising back-contact solar cells. The multi-layered structure comprises a non-extendible intermediate layer (240) comprised of a dielectric material. The multi-layered structure further comprises an upper layer (280) of an encapsulating material coupled to the upper surface (242) of the intermediate layer, as well as a lower layer (270) of a thermo-adhesive material coupled to the lower surface (244) of the intermediate layer (240). The multi-layered structure also has a plurality of through-holes pierced at predetermined positions.