Back Contact Solar Cell Module with Integrated Circuitry
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Solution Overview
Problem
Existing back-contact photovoltaic modules face challenges in efficiently and cost-effectively integrating conductive circuitry, with current methods being time-consuming and difficult to implement consistently.
Innovation Solution
A process involving a porous wire mounting layer with elongated electrically conductive wires and a polymeric encapsulant layer is used to securely integrate conductive circuitry within the module, where the encapsulant layer is melted and solidified to adhere to the solar cells and wire mounting layer, providing a stable and efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal foil is adhesively bonded to carrier material and patterned using photolithography or screen printing, then conductive circuitry can be formed, but the process becomes expensive and time consuming
Solution Approach 1:
The patent extracts and eliminates the complex multi-step processes (adhesive bonding, photolithography, screen printing) by directly forming conductive paste patterns on the back contact cells during the encapsulation process. This removes unnecessary intermediate steps while maintaining reliable conductive circuitry integration.
Solution Approach 2:
The encapsulant material serves multiple functions: it provides mechanical support, electrical insulation, environmental protection, and simultaneously acts as the medium for forming conductive circuits. The conductive paste is integrated into the encapsulation process, making the encapsulation step perform both structural and circuit-forming functions.
2Reliability
If multiple conducting ribbons are placed and connected between solar cells, then electrical connections can be established, but the process is time consuming and difficult to do consistently
Solution Approach 1:
The patent merges the electrical connection process with the encapsulation process by applying conductive paste directly onto the back contact cells during encapsulation. This combines two separate operations (connection making and encapsulation) into one unified process step, eliminating the need for separate ribbon placement and connection steps.
Solution Approach 2:
The conductive paste automatically forms reliable electrical connections as it is applied during the encapsulation process. The paste self-aligns with the back contact cells and forms connections without requiring precise manual placement or additional connection steps, making the process both simple and reliable.
3Reliability
If front contacts are placed on sunlight receiving side of photovoltaic cells, then electrical contacts are provided, but up to 10% shading loss occurs
Solution Approach 1:
The patent inverts the conventional contact arrangement by placing all electrical contacts on the back surface of the photovoltaic cells instead of the front sunlight-receiving surface. This inversion eliminates the shading problem entirely while maintaining full electrical contact functionality through the conductive paste integrated into the back contact structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a more efficient and cost-effective integration of conductive circuitry, enhancing the production process and ensuring reliable electrical connections within the back-contact solar cell modules.
Implementation Method 1
the encapsulant layer is melted and solidified to adhere to the solar cells and wire mounting layer
Implementation Method 2
the encapsulant layer is melted and solidified to adhere to the solar cells and wire mounting layer
Data Source
AI summary
A back-contact solar cell module and a process for making such a solar cell module are provided. The module includes a porous wire mounting layer with a plurality of elongated electrically conductive wires mounted thereon. A polymeric encapsulant layer is provided between a rear surface of solar cells of the module and the porous wire mounting layer and is melted to adhere to the solar cells and penetrate the porous wire mounting layer. Back electrical contacts on the solar cells are electrically connected to the electrically conductive wires through the porous wire mounting layer.