Back Cover Assembly Antenna Design for NFC Signal Integrity

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Solution Overview

Problem

Near field communication antennas integrated into electronic devices are often weakened by metal casings, leading to restricted placement and reduced signal transmission due to high-frequency signal interference, resulting in weak magnetic field coupling.

Innovation Solution

A back cover assembly comprising a substrate structure with a metal and non-metal substrate connected by an insulation layer, featuring a coil structure with a larger first coil portion above the metal substrate and a smaller second coil portion above the non-metal substrate, allowing the antenna magnetic field to pass through the non-metal substrate without matching with the metal substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a near field communication antenna is integrated into an electronic device with a metal casing, then the device can perform wireless communication functions, but the high-frequency signals are weakened or blocked by the metal casing

Engineering Contradiction:
Improvewireless communication functionVSAvoidsignal weakening
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The back cover is divided into metal and non-metal portions, with the coil structure strategically positioned to have a larger portion above the metal substrate and a smaller portion above the non-metal substrate. This segmentation allows the antenna to function while minimizing metal interference with the magnetic field.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the coil structure are positioned in different locations relative to the metal and non-metal substrates. The larger first coil portion is disposed above the metal substrate while the smaller second coil portion is disposed above the non-metal substrate, creating local variations in the magnetic field distribution to optimize performance.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If the area of the near field communication antenna is reduced to fit device constraints, then the device can maintain compact dimensions, but the magnetic field coupling becomes weaker

Engineering Contradiction:
Improveantenna areaVSAvoidmagnetic field coupling
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent changes the geometric parameters of the coil structure by creating an asymmetric design where the first coil portion has a larger area than the second coil portion. This parameter optimization allows the antenna to achieve effective magnetic field coupling within the constrained space of the portable electronic device.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the ability of near field communication antennas to transmit energy by shielding the magnetic field from the metal substrate, improving signal strength and reducing interference, thus enabling more effective information exchange and transaction capabilities.

Implementation Method 1

near field communication is a short-range high-frequency wireless communication technology in which interconnection and intercommunication between electronic devices within a short distance can be realized by using magnetic induction principle

Methodology Applied
Scientific EffectMagnetic induction: Electromagnetic Induction

Implementation Method 2

The insulation structure includes a first insulation layer disposed on the metal substrate and the first non-metal substrate. The coil structure is surroundingly disposed on the first insulation layer

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10411331B2Back cover assembly
Publication Date: 2019.09.10 INPAQ TECHNOLOGY CO LTD
  • US10411331B2 patent drawing
  • US10411331B2 patent drawing
  • US10411331B2 patent drawing

AI summary

The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.