Back Grinding Tape Tabs for Safer Wafer De-Taping
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Solution Overview
Problem
The existing methods for removing back grinding (BG) tape from a wafer are complex and prone to causing wafer cracking due to improper attachment of de-taping tape.
Innovation Solution
The introduction of back grinding tape with one or more tabs extending from its perimeter, which serves as a gripping region for simplified removal of the tape from the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If de-taping tape is used to remove BG tape from wafer, then BG tape can be removed from wafer, but the process becomes complex and wafer cracking may occur due to improper attachment
Solution Approach 1:
The patent extracts the gripping function from the separate de-taping tape and integrates it directly into the BG tape by adding tabs extending from the BG tape perimeter. This eliminates the need for a separate de-taping tape while maintaining the removal capability, thereby simplifying the overall process and reducing complexity.
Solution Approach 2:
The patent merges the BG tape and gripping elements into a single integrated structure where tabs are formed as part of the BG tape itself. This combination eliminates the need for separate de-taping tape application steps and reduces the risk of improper attachment, directly addressing the complexity issue.
2Ease of manufacture
If de-taping tape is used to remove BG tape from wafer, then BG tape can be removed from wafer, but wafer cracking may occur due to improper attachment
Solution Approach 1:
The patent removes the separate de-taping tape step entirely and extracts the gripping function into the BG tape tabs themselves. This eliminates the source of improper attachment and wafer cracking while maintaining effective BG tape removal, thereby improving reliability without sacrificing ease of manufacture.
Solution Approach 2:
The BG tape tabs are designed to be self-gripping elements that extend beyond the wafer edge, allowing the BG tape to be removed directly without requiring external de-taping tape. This self-service approach eliminates attachment errors and protects wafer integrity.
3Ease of operation
If tabs are added to BG tape for gripping, then removal process is simplified, but BG tape structure becomes more complex
Solution Approach 1:
The patent segments the BG tape structure by adding discrete tabs extending from the perimeter, which provide dedicated gripping zones. This segmentation simplifies the removal operation by providing clear grip points while adding minimal structural complexity compared to a completely different removal mechanism.
Solution Approach 2:
The tabs are pre-formed as part of the BG tape structure before application to the wafer. This preliminary action ensures that the gripping elements are already in place and properly positioned, simplifying the subsequent removal operation without requiring complex real-time adjustments or additional components.
Data Source
AI summary
A back grinding tape (BG) has one or more tabs extending from a center region. The center region is adhered to a wafer during a wafer back grinding step of a semiconductor die fabrication process. When the wafer back grinding step is complete, a sensor directs a gripping mechanism to a particular tab. When the gripping mechanisms has grabbed a gripping region defined by the tab, a table on which the wafer is placed moves in a particular direction. Movement of the table, in combination with the gripping mechanism holding the gripping region, causes the BG tape to be removed from the wafer.