Back-Injected Molded Part with Printed Functional Layer
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Solution Overview
Problem
The integration of functional elements like wire heaters and sensors into molded parts with a cover substrate and a back-injected or back-foamed carrier layer is challenging due to mechanical stress and complex seam patterns, leading to difficulties in electrical contacting and reduced heating efficiency or accurate measurement results.
Innovation Solution
An electrically conductive functional layer is printed onto a non-conductive carrier film using conductive paste, decoupled from the cover substrate, and back-foamed or back-injected to create an adhesive connection, allowing for simplified contacting and direct heating or sensing without additional foam, with conductor tracks and electrodes adapted to the specific application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If wire heating elements are incorporated into or beneath the surface substrate, then heating function is achieved, but seating comfort is reduced and the structure becomes more complex
Solution Approach 1:
The heating function is extracted from the substrate structure and placed into a separate functional layer. This functional layer contains the wire heating elements and is positioned between the substrate and the carrier layer, allowing the substrate to remain smooth and comfortable while still achieving the heating effect.
Solution Approach 2:
A functional layer is introduced as an intermediary between the substrate and the carrier layer. This functional layer serves as a mediator that carries the heating elements and allows electrical contacting without requiring modifications to the substrate structure, thereby maintaining seating comfort.
2Ease of operation
If a foam layer is added to cushion functional elements, then seating comfort is improved, but heating efficiency is reduced
Solution Approach 1:
The cushioning function is extracted from the heating system and placed into the carrier layer. The carrier layer, which is back-foamed or back-injected, provides mechanical cushioning and support without interfering with the thermal contact between the functional layer and the substrate, thus maintaining heating efficiency.
3Stability of the object's composition
If the functional layer is bonded to the top substrate with numerous seams, then integration is achieved, but mechanical stress increases and contacting becomes more difficult
Solution Approach 1:
The functional layer is extracted from direct bonding to the substrate and instead bonded to the carrier layer. This separation allows the functional layer to be integrated into the molded part without being constrained by the substrate's seam pattern, simplifying the contacting process.
Solution Approach 2:
The molded part is segmented into distinct functional layers: the substrate, the functional layer with heating elements, and the carrier layer. This segmentation allows each layer to be optimized independently, with the functional layer positioned where it can be easily contacted without being affected by substrate seams.
4Use of energy by moving object
If very thin wires or soft electrical functional films are used, then heating function is achieved, but electrical contacting becomes technically complex and error-prone
Solution Approach 1:
The carrier layer serves as an intermediary that provides a stable bonding surface for the functional layer. This allows electrical contacting to be performed on the carrier layer or through the carrier layer, rather than directly on the thin functional film, reducing the complexity and error rate of the contacting process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies electrical contacting, enhances heating efficiency, and improves sensor accuracy by eliminating the need for additional foam and allowing for precise adaptation of conductor tracks to the molded part's contour, while reducing mechanical stress during production.
Implementation Method 1
conductor tracks printed onto the carrier film and dried by curing, made of at least one electrically conductive paste
Implementation Method 2
conductor tracks printed onto the carrier film and dried by curing
Implementation Method 3
wire mesh is incorporated into or beneath the surface substrate, which, when an electric current is applied, acts as a resistance heater and heats up
Implementation Method 4
the carrier layer is back-foamed or back-injected on the side of the functional layer facing away from the top substrate and is bonded firmly to the functional layer
Implementation Method 5
the carrier layer is back-foamed or back-injected on the side of the functional layer facing away from the top substrate
Data Source
Figure 1
AI summary
The invention relates to a molded part (1) comprising a top substrate (12) forming the visible surface and a back-injected or back-foamed carrier layer (10) made of plastic material, wherein an electrically conductive functional layer (11) is provided below the top substrate (12), which can be contacted by means of electrodes and is formed from an electrically non-conductive carrier film and conductive traces printed onto the carrier film and cured and dried, made of at least one electrically conductive paste, and the carrier layer (10) is back-foamed or back-injected on the side of the functional layer (11) facing away from the top substrate (12) and is bonded firmly to the functional layer (11). A method for producing such a molded part and its use are also described.