Back Nozzle Unit With Multi-Angle Gas Flow for Substrate Drying
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Solution Overview
Problem
Conventional substrate processing apparatuses have reduced efficiency in cleaning and drying processes due to back nozzles and gas nozzles that only spray perpendicular to the substrate, leading to incomplete removal of impurities and moisture, which can cause defects in integrated circuit and display devices.
Innovation Solution
A back nozzle unit with a skirt and flow paths that provide cleaning solutions and gases in directions parallel and inclined to the substrate, enhancing the cleaning and drying effects by ensuring thorough coverage and efficient removal of impurities and moisture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional back nozzles and gas nozzle spray cleaning solution and gas only in perpendicular direction to substrate bottom surface, then the structure is simple, but the cleaning efficiency and drying efficiency are reduced
Solution Approach 1:
The gas nozzle is divided into multiple independent gas nozzles (first gas nozzle, second gas nozzle, third gas nozzle) that spray gas in different directions (perpendicular, inclined, and parallel to substrate bottom surface). This segmentation allows comprehensive coverage of the substrate bottom surface from multiple angles, significantly improving cleaning efficiency and drying efficiency while maintaining reasonable structural complexity
Solution Approach 2:
The patent introduces multi-directional spraying by adding inclined and parallel spray directions in addition to the conventional perpendicular direction. This dimensional expansion of the spraying pattern enables the cleaning solution and gas to reach different areas of the substrate bottom surface more effectively, resolving the contradiction between simple structure and high cleaning efficiency
2Productivity
If conventional gas nozzle sprays gas only perpendicular to substrate bottom surface, then the nozzle structure is simple, but the drying efficiency is reduced
Solution Approach 1:
The gas delivery system is segmented into multiple gas nozzles with different orientations. The first gas nozzle sprays perpendicular to the substrate, the second gas nozzle sprays at an inclination angle, and the third gas nozzle sprays parallel to the substrate bottom surface. This segmentation enables comprehensive drying coverage while maintaining manageable structural complexity
Solution Approach 2:
The gas spraying is extended from a single perpendicular dimension to multiple dimensions including inclined and parallel directions. This multi-dimensional approach ensures that gas reaches all areas of the substrate bottom surface for effective drying, resolving the contradiction between simple nozzle structure and high drying efficiency
3Reliability
If cleaning solution and gas are sprayed only in perpendicular direction, then the spray system is simple, but impurities on substrate bottom surface are not effectively removed
Solution Approach 1:
The spray system is segmented into multiple nozzles (back nozzles for cleaning solution and gas nozzles for gas) positioned at different locations and orientations. This segmentation ensures that cleaning solution and gas reach the substrate bottom surface from multiple angles, effectively removing impurities while maintaining reasonable system complexity
Solution Approach 2:
The spray system incorporates multi-directional spraying in perpendicular, inclined, and parallel directions to comprehensively cover the substrate bottom surface. This multi-dimensional approach ensures thorough removal of impurities, resolving the contradiction between simple spray system and high substrate quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced cleaning and drying processes improve the performance and reliability of integrated circuit and display devices by ensuring effective removal of impurities and moisture from the substrate, leading to improved manufacturing outcomes.
Implementation Method 1
The at least one back nozzle may protrude from the skirt and may provide a cleaning solution onto the bottom face of the substrate
Implementation Method 2
The gas nozzle may provide the gas in a direction substantially perpendicular to the bottom face of the substrate
Implementation Method 3
The plurality of flow path may be formed in the body and may provide a gas toward the bottom face of the substrate
Data Source
AI summary
An apparatus for processing a substrate may include a processing module including at least one process chamber performing a desired process on a substrate and an index module transferring the substrate from an outside into the processing module. The at least one process chamber may include a supporting unit on which the substrate is placed and a back nozzle unit disposed under a bottom face of the substrate. The back nozzle unit may include a skirt, at least one back nozzle providing a cleaning solution onto the bottom face of the substrate and a gas nozzle providing a gas onto the bottom face of the substrate. The skirt may include a body and a plurality of first flow paths and a plurality of second flow paths which are formed in the body and provide a gas toward the bottom face of the substrate.