Back Panel Assembly with Exposed Insulating Layer for Circuit Board Mounting

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Solution Overview

Problem

Existing display device manufacturing methods face challenges in reducing thickness while ensuring structural strength and preventing short circuits, as they often require additional fixing operations and increased thickness due to the need for insulating materials and conductive components.

Innovation Solution

A back panel assembly comprising a composite structure with a conductive first and second plate and an insulating material layer, where the insulating layer is exposed through a cutout in the second plate, allowing the circuit board to be mounted directly on it, preventing short circuits and reducing device thickness through a snap structure and positioning members for secure fixation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal material or alloy material is used for the back panel to provide sufficient structural strength, then the structural strength is improved, but the device thickness cannot be reduced further due to the need for additional insulating layers and fixing structures

Engineering Contradiction:
Improvestructural strengthVSAvoiddevice thickness
Core Design Contradiction:
StrengthVSLength of stationary object

Solution Approach 1:

The patent combines the insulating layer and the circuit board mounting function into a single integrated structure. The insulating layer is formed directly on the back panel with an exposed portion that serves as the mounting surface for the circuit board, eliminating the need for separate insulating components and reducing overall device thickness while maintaining structural strength and electrical insulation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The back panel assembly uses a composite structure combining metal or alloy material for the back panel with an insulating material layer (such as PC, ABS, or their composites). This composite approach allows the metal panel to provide structural strength while the insulating layer provides electrical isolation, enabling thin design without compromising strength or insulation performance.

Inventive Principle:
Principle #40Composite materials

2Reliability

If additional fixing operations (adhering, bolt fixing) are used to mount the circuit board, then the reliability of circuit board fixation is improved, but the assembly efficiency deteriorates due to increased manufacturing steps

Engineering Contradiction:
Improvecircuit board fixation reliabilityVSAvoidassembly efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The insulating layer's exposed portion inherently provides both the mounting surface and the fixation mechanism for the circuit board. The circuit board is directly mounted on the exposed portion of the insulating layer without requiring additional fixing operations, allowing the structure to serve its own fixation function and significantly improving assembly efficiency while maintaining reliable fixation.

Inventive Principle:
Principle #25Self-service

3Ease of manufacture

If a conventional plastic material is used for the back panel, then the ease of manufacture is improved, but the structural strength is insufficient and the device cannot be made thinner

Engineering Contradiction:
Improvemanufacturing easeVSAvoidstructural strength
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent employs composite materials where the back panel is made of metal or alloy material providing high structural strength, while the insulating layer uses conventional plastics (PC, ABS, or their composites) that are easy to manufacture. This division allows each material to发挥 its advantages: metal for strength and thinness, plastic for ease of manufacturing the insulating layer.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS10509247B2Back panel assembly and display device having the same
Publication Date: 2019.12.17 BOE TECHNOLOGY GROUP CO LTD
  • US10509247B2 patent drawing
  • US10509247B2 patent drawing
  • US10509247B2 patent drawing

AI summary

The present disclosure provides a back panel assembly including a back panel and a circuit board disposed on the back panel, the back panel includes: a first plate, a second plate opposite to the first plate and an insulating material layer interposed between the first and second plates, the second plate includes a cutout portion such that the insulating material layer have an exposed portion exposed by the cutout portion; and the circuit board is disposed on the exposed portion of the insulating material layer. The present disclosure also provides a display device. The display device includes a display panel and the above back panel assembly, the display panel is positioned on a side of the first plate of the back panel, and the circuit board is configured to control the display panel.