Back Side Inductor Integration in Semiconductor Packages
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Solution Overview
Problem
The semiconductor industry faces challenges in integrating inductors into semiconductor device packages without additional processing steps, as existing methods require complex modifications to lithography masks and packaging processes, which can lead to interference with other components and increased costs.
Innovation Solution
The integration of inductors is achieved by forming them in the material layer of the back side interconnect structure of the package, avoiding conductive features over the inductor region and using a shielding plate to prevent interference, thus allowing for existing lithography masks and packaging processes to be modified without additional steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inductors are integrated into semiconductor device packages using existing methods, then inductor functionality is achieved, but complex modifications to lithography masks and packaging processes are required
Solution Approach 1:
The patent merges the inductor formation process with the existing back side interconnect structure fabrication process. The inductor windings are formed simultaneously with the interconnect layers using the same lithography and deposition steps, eliminating the need for separate inductor fabrication processes and complex mask modifications.
Solution Approach 2:
The back side interconnect structure serves multiple functions: it provides both the interconnect pathways for electrical signals and the inductor windings for magnetic field generation. This multi-functionality allows a single structure to fulfill both interconnection and passive component requirements without additional processing steps.
2Adaptability or versatility
If complex modifications are made to lithography masks and packaging processes, then inductor integration is achieved, but interference with other components increases
Solution Approach 1:
The patent applies local quality by creating an inductor region with specific properties distinct from other areas of the package. The inductor windings are localized to a specific region on the back side, with controlled trace patterns and spacing that optimize magnetic field confinement and minimize interference with adjacent components while maintaining standard fabrication processes elsewhere.
3Adaptability or versatility
If complex modifications are made to lithography masks and packaging processes, then inductor integration is achieved, but manufacturing costs increase
Solution Approach 1:
The patent combines inductor fabrication with existing interconnect structure manufacturing, utilizing the same lithography masks, deposition processes, and packaging steps. This merging eliminates the need for additional manufacturing equipment, process development, and quality control procedures that would otherwise be required for separate inductor fabrication.
Solution Approach 2:
The existing back side interconnect structure fabrication process serves dual purposes: creating interconnect pathways and forming inductor windings. The standard deposition and patterning processes automatically create the inductor structure as part of the interconnect layer, requiring no additional manufacturing resources or process steps.
Data Source
AI summary
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a back side interconnect structure, and a winding of an inductor disposed in a material layer of the back side interconnect structure. A molding material is coupled to the back side interconnect structure. The package includes an integrated circuit die mounting region disposed within the molding material.