Back-Surface Processing Unit for Borderless Display Devices
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Solution Overview
Problem
Conventional display devices have a large non-display area due to the integration of processing and display units on the same substrate, limiting effective display space.
Innovation Solution
A display device design featuring a substrate with a first and second surface, where a first conductive layer on the first surface is electrically connected to a second conductive layer on the second surface through a connective portion that penetrates the substrate, allowing for signal transmission from the processing unit to the display element layer without occupying additional space on the display surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the processing unit and display unit are formed on the same surface of the substrate, then the device structure is simplified and ease of manufacture is improved, but the non-display area becomes large and the effective display space is limited
Solution Approach 1:
The patent moves the processing unit from the front surface to the back surface of the substrate, utilizing the third dimension (depth/thickness) to resolve the conflict. This allows the display unit to occupy the entire front surface while the processing unit is positioned on the back surface, connected through conductive layers and connective portions penetrating the substrate, thereby eliminating the non-display area on the front surface.
2Device complexity
If the processing unit is positioned on the same surface as the display unit, then device complexity is reduced, but the display area is limited by the non-display area
Solution Approach 1:
The patent positions the processing unit on the back surface of the substrate while the display unit is on the front surface, utilizing the substrate thickness as an additional dimension. This spatial separation eliminates the need for large non-display areas on the front surface, thereby maximizing the display area while maintaining relatively simple device structure through the use of conductive layers and connective portions.
3Area of stationary object
If conductive layers and connective portions are used to connect the processing unit and display unit on opposite surfaces, then the effective display area is maximized, but the device structure becomes more complex
Solution Approach 1:
The patent divides the conductive connection path into multiple segments: a first conductive layer on the front surface, a second conductive layer on the back surface, and connective portions penetrating the substrate to connect these layers. This segmentation allows each component to be optimized independently while achieving the overall goal of maximizing display area through the positioning of the processing unit on the back surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances display area utilization by minimizing the non-display area, enabling a display device with a narrower or borderless format while maintaining effective signal transmission.
Implementation Method 1
a first connective portion at least partially disposed in the substrate and penetrating from the first surface to the second surface, wherein the first conductive layer is electrically connected to the second conductive layer through the first connective portion
Data Source
AI summary
A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface. The display device also includes a first conductive layer disposed on the first surface and a second conductive layer disposed on the second surface. The display device further includes a processing unit disposed on the second surface and is electrically connected to the processing unit and a first connective portion which at least partially disposed in the substrate, and penetrating from the first surface to the second surface, wherein the first conductive layer is electrically connected to the second conductive layer through the first connective portion.