Back-to-Back Capacitor Mounting for Circuit Board Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The micro-phony phenomenon caused by multilayer ceramic capacitors in circuit boards results in acoustic noise due to vibration and friction, which is not effectively mitigated by existing technologies.
Innovation Solution
A circuit board device is designed with a substrate and two capacitor packaging areas on either side, where identical multilayer ceramic capacitors are mounted with pads set back-to-back and electrically connected, counteracting the forces causing vibration and reducing contact area with the substrate to minimize noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multilayer ceramic capacitors are mounted on circuit boards, then the circuit board can achieve small size, cheap price and good frequency performance, but the ripple noise causes the capacitors to vibrate and produce acoustic noise
Solution Approach 1:
The patent applies the counterweight principle by mounting identical capacitors in opposite orientations on opposite sides of the circuit board. The ripple noise forces acting on these capacitors are equal in magnitude but opposite in direction, causing them to counterbalance each other and eliminate the net vibration that would otherwise produce acoustic noise.
Solution Approach 2:
The patent uses asymmetric placement by positioning capacitor packaging areas on opposite sides of the substrate in a back-to-back manner, with pads arranged symmetrically relative to the board center but asymmetrically relative to each other. This asymmetric configuration ensures that the ripple noise forces do not align and thus do not reinforce each other, instead canceling out to reduce acoustic noise.
2Area of stationary object
If capacitors are mounted close to each other to reduce space, then the circuit board size is reduced, but the friction and vibration between capacitors and substrate increase acoustic noise
Solution Approach 1:
By placing identical capacitors in opposite orientations on opposite sides of the board, the patent creates a counterbalancing configuration where the vibration forces generated by ripple noise cancel each other out. This allows capacitors to be mounted close together without generating significant acoustic noise, as the opposing capacitors counteract the forces that would cause friction-based vibration.
3Object-generated harmful factors
If identical capacitors are mounted with back-to-back pad configuration, then the forces causing vibration are counteracted, but the device complexity increases
Solution Approach 1:
The patent implements a counterweight configuration where identical capacitors are mounted in opposite orientations with back-to-back pad connections. This symmetric arrangement creates equal and opposite forces that cancel vibration, effectively eliminating acoustic noise while maintaining a relatively simple and symmetrical layout that does not significantly increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the micro-phony phenomenon and associated acoustic noise by counteracting the forces causing vibration and minimizing friction between capacitors and the substrate.
Implementation Method 1
the ripple noise in the circuit board makes the structures of the multilayer ceramic capacitor vibrate
Implementation Method 2
the micro-phony phenomenon (high-frequency micro-phony phenomenon) occurs thereby
Data Source
AI summary
A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other.