Back-to-Back Integrated Circuit Chip Assembly for Side-Channel Attack Protection
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Solution Overview
Problem
Existing systems fail to effectively protect integrated circuits against back-side attacks, which involve accessing the back side of the circuit to inject faults or measure responses, as they require forming openings to reach active areas, posing a risk to data confidentiality and security.
Innovation Solution
The solution involves assembling at least two integrated circuit chips back-to-back with a glue layer, adhesive film, or molecular bonding, creating a cavity or trenches on the back side to embrittle the chips, making them breakable if separated, and connecting front-side contacts to a substrate, ensuring that even if one chip is attacked, the assembly remains non-functional.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two integrated circuit chips are assembled back-to-back with bonding, then protection against back-side attacks is improved, but device complexity increases
Solution Approach 1:
The protective structure is segmented into multiple independent chips (first chip and second chip) assembled back-to-back. Each chip can be independently analyzed, and the segmentation allows the system to maintain functionality while providing protection through the distributed architecture.
Solution Approach 2:
The two chips are nested together in a back-to-back configuration where the back side of the first chip bonds directly to the back side of the second chip. This nesting creates a compact protective structure where one chip is effectively embedded within the assembly of the other, providing mutual protection.
2Strength
If chips are assembled by welding or molecular bonding, then protection against separation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The bonding method parameters are changed to achieve optimal balance between bonding strength and manufacturing feasibility. Different bonding techniques (welding, molecular bonding, adhesive films) offer different parameter combinations of bond strength, temperature requirements, and alignment tolerances, allowing selection based on specific application needs.
3Object-affected harmful factors
If trenches or sawing lines are created on chip back side, then resistance to attack is improved, but manufacturing complexity increases
Solution Approach 1:
The trenches or sawing lines are created locally on the back side of the chips rather than modifying the entire chip structure. This localized modification provides the necessary resistance to back-side attacks while minimizing the overall structural complexity and maintaining the bulk functionality of the chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances protection against back-side attacks by ensuring that attempting to separate or access the chips results in their destruction, rendering the attack ineffective, while being compatible with existing countermeasures and not requiring modifications to the chip's components or manufacturing processes.
Implementation Method 1
the chips are assembled by a glue layer
Implementation Method 2
the chips are assembled by an adhesive film
Implementation Method 3
the chips are assembled by molecular bonding
Implementation Method 4
the cavity is intended to receive the glue for assembling the chips together
Data Source
AI summary
A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.