Back-to-Back Die Packaging for Anti-Probing Side Protection
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Solution Overview
Problem
Semiconductor packages are vulnerable to probing and intrusion attacks, particularly on sides other than the front or top, which can lead to unauthorized access and counterfeiting, as existing anti-probing measures are insufficient on these exposed areas.
Innovation Solution
The implementation of back-to-back (BTB) die semiconductor packages with Si blocks on lateral sides, which are designed to cease functioning if an electrical connection is broken, providing enhanced protection and thermal management through heat sinks and electromagnetic interference (EMI) shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor packages are used with exposed sides, then manufacturing and assembly are simpler, but the packages are vulnerable to probing and intrusion attacks
Solution Approach 1:
The semiconductor package is divided into two separate dies (first die and second die) mounted back-to-back on opposite sides of the substrate. This segmentation ensures that each die has its protected surfaces facing outward, eliminating exposed vulnerable surfaces while maintaining functional integrity. The physical separation and opposite mounting configuration directly address the security vulnerability without requiring complex internal shielding structures.
Solution Approach 2:
The invention transitions from a single-sided or conventional multi-sided package to a three-dimensional back-to-back configuration where dies are mounted on opposite faces of the substrate. This dimensional arrangement ensures that the largest surfaces of both dies are protected by the package structure itself, as each die's front surface faces outward while its back surface is bonded to the substrate, eliminating probing vulnerabilities.
2Reliability
If anti-probing measures are added to all sides of the die, then security is improved, but manufacturing complexity and cost increase
Solution Approach 1:
By segmenting the package into two separately mounted dies, the invention achieves complete surface protection without requiring anti-probing measures on all sides of a single die. Each die only needs standard bonding on its back surface, while its front surface is naturally protected by the package structure, simplifying manufacturing compared to applying protective measures to multiple surfaces of one die.
Solution Approach 2:
The back-to-back configuration allows the package structure itself to provide the anti-probing protection, eliminating the need for additional anti-probing layers or measures on the die surfaces. The structural arrangement of having dies on opposite sides makes the package inherently resistant to probing attacks without requiring extra manufacturing steps for protection.
3Temperature
If heat sinks are added to improve thermal management, then temperature control is improved, but device complexity increases
Solution Approach 1:
The substrate serving as the mounting platform for both dies also functions as the thermal management structure, with heat sinks attached to the substrate to dissipate heat from both dies simultaneously. This multi-functional design provides thermal management without adding separate complex cooling systems for each die, as the single substrate-heat sink structure serves both thermal and structural purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The BTB die configuration effectively thwarts intrusion attempts by ensuring the semiconductor package ceases to function if compromised, while also improving thermal dissipation and EMI shielding, thus enhancing security and reliability.
Implementation Method 1
improving thermal dissipation
Implementation Method 2
thermal dissipation
Implementation Method 3
electromagnetic interference (EMI) shielding
Data Source
AI summary
Systems, apparatuses, and methods for back-to-back (BTB) die for semiconductor packages are provided. For example, a semiconductor package may include a BTB die electrically coupled to a plurality of a Si blocks that may be positioned laterally from the BTB die. The semiconductor package may include a heat sink that is also electrically coupled to a plurality of Si blocks that may be positioned laterally from the BTB die. The Si blocks may be electrically coupled to terminals on a side of the semiconductor package. The Si blocks may provide for improved protection, thermal managements, and shielding.