Back-to-Back Solid-State Emitters for Multi-Plane Lighting and Heat Control
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Solution Overview
Problem
Conventional solid state lights (SSLs) typically emit light from a single plane, complicating manufacture and increasing package size, and are sensitive to heat, which accelerates the deterioration of heat-sensitive components.
Innovation Solution
The development of SSLs with at least two solid state emitters oriented in a back-to-back configuration, utilizing through substrate interconnects and a carrier substrate with multiple surfaces for light emission, along with heat management techniques such as aluminum nitride substrates and reflective materials for thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional SSLs use a single-plane configuration, then the package structure is simple, but the illumination intensity is insufficient and package size increases
Solution Approach 1:
The patent transitions from a single-plane configuration to a multi-plane configuration by stacking SSL devices vertically. This dimensional change allows light to be emitted from multiple planes (front, back, and lateral surfaces), significantly increasing illumination intensity without proportionally increasing package footprint. The through-substrate interconnects enable this vertical stacking by providing electrical connections through the substrate thickness.
Solution Approach 2:
The patent implements nested stacking where multiple SSL devices are vertically integrated within a compact package structure. Each SSL device is positioned at different vertical levels and connected through the substrate, creating a nested arrangement that maximizes light output within a minimized package volume.
2Illumination intensity
If multiple SSL devices are stacked vertically, then illumination intensity increases, but heat accumulation accelerates component deterioration
Solution Approach 1:
The patent extracts heat from the stacked SSL devices by implementing dedicated thermal management structures. Heat sinks are attached to the package to conduct heat away from the SSL devices, and thermal vias are created through the substrate to conduct heat vertically, separating the heat generation source from the sensitive components.
Solution Approach 2:
The substrate serves as a thermal intermediary, conducting heat away from the SSL devices through its thickness. The through-substrate interconnects and thermal vias act as thermal pathways, mediating heat transfer from the active regions to the heat sinks and package exterior, preventing heat accumulation.
3Adaptability or versatility
If through substrate interconnects are used for vertical stacking, then multi-plane emission is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent segments the electrical connection function into discrete through-substrate interconnect elements. Each interconnect is a separate feature formed through the substrate, allowing independent formation and connection to different SSL devices. This segmentation simplifies the manufacturing process compared to creating complex integrated through-connections.
Solution Approach 2:
The patent replaces complex mechanical wiring approaches with direct through-substrate electrical interconnects. Instead of using external wires and connectors to achieve vertical electrical connections, the electrical pathways are formed directly through the substrate material, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for multi-plane light emission, increasing illumination intensity and reducing package size, while effective heat management extends the lifespan of heat-sensitive components and maintains light quality.
Implementation Method 1
effective heat management extends the lifespan of heat-sensitive components
Implementation Method 2
reflective materials for thermal conductivity
Data Source
AI summary
Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.