Back-to-Back Power Package Layout for Heat and Parasitic Control
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Solution Overview
Problem
Existing power electronic devices face challenges in achieving compact dimensions and efficient heat dissipation while accommodating circuit topologies with power devices coupled in source-to-source or drain-to-drain configurations, particularly for high-voltage and rapid-switching devices like silicon carbide and gallium nitride-based MOSFETs and IGBTs.
Innovation Solution
A packaged electronic device design that integrates power devices in a source-to-source or drain-to-drain configuration within a single housing, utilizing DBC-Direct Bonded Copper substrates with patterned conductive layers to form islands for electrical connections and thermal dispersion, allowing for compact and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power devices are coupled in source-to-source or drain-to-drain configuration within a single package, then circuit complexity is reduced and reliability is improved, but manufacturing complexity increases due to the need for precise conductive layer patterning and die coupling
Solution Approach 1:
The patent merges multiple power devices (first and second power devices) into a single package with coupled sources or drains, creating an integrated circuit module. The conductive layers and islands are designed to electrically connect the devices, achieving functional integration that improves reliability while managing the manufacturing complexity through systematic design of the conductive structure.
Solution Approach 2:
The conductive layers and islands serve multiple functions: they provide electrical connections between power devices, form thermal management paths, and enable different circuit configurations (source-to-source or drain-to-drain coupling). This multi-functionality allows a single package design to support various circuit topologies, improving versatility without proportionally increasing manufacturing complexity.
2Volume of moving object
If multiple power devices are integrated in a single package with coupled sources or drains, then device compactness is improved, but heat dissipation challenges increase due to higher power density
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by utilizing vertical heat paths through the substrate and back-side cooling structures. The conductive layers are arranged in multiple levels and orientations, enabling heat to be conducted in multiple spatial dimensions, thereby effectively managing thermal density in compact packages.
Solution Approach 2:
The conductive layers and substrate structures act as thermal intermediaries, conducting heat away from the power devices through dedicated thermal paths. These intermediary structures facilitate heat transfer from the high-power-density regions to external heat sinks, managing temperature rise despite the compact integration of multiple devices.
3Power
If power devices operate at high voltage with rapid switching, then power efficiency is improved, but parasitic effects increase due to fast current transitions
Solution Approach 1:
The conductive layers are designed with varying local properties: low-inductance paths in regions with fast current transitions, and higher impedance in regions where voltage stability is critical. The island geometries and conductive layer thicknesses are locally optimized to minimize parasitic inductance and resistance at specific locations, thereby reducing harmful parasitic effects while maintaining high power efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables compact, reliable, and high-dissipation packages suitable for complex circuits, reducing parasitic effects and enhancing reliability by effectively managing heat and electrical connections for high-voltage, rapid-switching power devices.
Implementation Method 1
utilizing DBC-Direct Bonded Copper substrates with patterned conductive layers to form islands for electrical connections and thermal dispersion
Implementation Method 2
patterned conductive layers to form islands for electrical connections
Data Source
AI summary
Electronic device having a first substrate element; a second substrate element; and a plurality of dice of semiconductor material integrating respective power devices and forming circuits having a separate terminal, a common terminal and an intermediate terminal, wherein the power devices are coupled in a same back-to-back configuration at the intermediate terminal. The first substrate element has a conductive layer patterned to form a first separate contact island coupled to the separate terminal of a first circuit; a second separate contact island coupled to the separate terminal of the second circuit; a common contact island coupled to the common terminal of the first and the second circuits. The second substrate element has a conductive layer patterned to form a first intermediate contact island coupled to the intermediate terminal of the first circuit, and a second intermediate contact island coupled to the intermediate terminal of the second circuit.