Backdrilled Vias for Selective Midplane Connectivity
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Solution Overview
Problem
In orthogonal midplane architectures, standard connectors often provide undesirable concurrent connectivity due to plated vias, making it challenging to achieve selective connectivity between components without custom connectors or contacts.
Innovation Solution
The use of backdrilled vias on a substrate, which creates a void with an electrically conductive lining, allowing selective connectivity by interference fit with one contact while maintaining electrical isolation from another, enables orthogonal header connectors to connect components without custom contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated vias are used to provide electrical conductivity between mounting contacts, then electrical connectivity between components is achieved, but undesirable concurrent connectivity occurs between mounting contacts
Solution Approach 1:
The via is segmented into two distinct portions: a first portion with conductive plating that connects to the first mounting contact, and a second portion without conductive plating that isolates the second mounting contact. This segmentation allows selective electrical connectivity while preventing harmful concurrent connectivity between mounting contacts.
Solution Approach 2:
Different portions of the via have different electrical properties: the first portion has conductive plating for electrical connection, while the second portion has no plating for electrical isolation. This local differentiation of quality enables the via to simultaneously provide connectivity where needed and isolation where harmful connectivity would occur.
2Ease of manufacture
If standard connectors are used in orthogonal orientation, then ease of manufacture is maintained, but selective connectivity to midplane components cannot be achieved
Solution Approach 1:
The connector design incorporates removable contacts that can be selectively present or absent, allowing the same standard orthogonal connector to adapt to different connectivity requirements. This dynamic configuration enables selective connectivity to midplane components while maintaining ease of manufacture with standard connectors.
Solution Approach 2:
Specific contacts within the connector are selectively removed or configured based on the desired connectivity pattern. This local differentiation allows the connector to provide selective connectivity to specific midplane components while maintaining the standard orthogonal form factor and ease of manufacture.
3Object-generated harmful factors
If via plating is removed to prevent concurrent connectivity, then electrical isolation is achieved, but interference fit with contacts is compromised
Solution Approach 1:
The via plating is segmented such that the first portion retains conductive plating to maintain interference fit with the first mounting contact, while the second portion has plating removed to prevent concurrent connectivity with the second mounting contact. This segmentation simultaneously achieves both mechanical retention and electrical isolation.
Solution Approach 2:
The via exhibits different electrical and mechanical properties at different locations: the first portion has plating for both electrical connectivity and mechanical interference fit, while the second portion has no plating for electrical isolation. This local quality differentiation resolves the contradiction between preventing harmful connectivity and maintaining mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for selective routing of signals and power in an orthogonal system architecture, enabling efficient connectivity without custom connectors, by ensuring that only specific contacts are electrically connected through the backdrilled vias, while others remain isolated.
Implementation Method 1
The void may have an electrically conductive lining on its inner surface. Backdrilling may remove a portion of the electrically conductive lining such that the electrically conductive lining and the first contact may be interference fit, and such that the electrically conductive lining does not electrically connect to the second contact
Implementation Method 2
Backdrilling may remove a portion of the electrically conductive lining such that the electrically conductive lining and the first contact may be interference fit
Data Source
AI summary
In an electrical system, such as an orthogonal, midplane architecture, backdrilling vias may enable selective connectivity to components of the midplane board without custom connectors and/or contacts. A first contact and a second contact may be received within a shared backdrilled via at opposite ends. The backdrilled via may establish electrical connectivity between the first contact and an internal conductive path of a midplane board. Because the backdrilling removes a portion of the via, the first contact and the second contact may be electrically isolated. The electrically conductive path between the first mounting contact and the internal conductive layer may be used for low-speed communications channel, power, ground, control signaling, or the like.