Ultrasound Probe Backing Component with Variable Packing Density
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Solution Overview
Problem
Conventional backing components for ultrasound probes face challenges in minimizing acoustic signal reflection and controlling pulse duration due to boundary layer effects, leading to poor image quality.
Innovation Solution
A backing component with a unitary structure featuring a variation in packing density of materials across its thickness, utilizing a combination of acoustic scatterers and absorbers, fabricated using additive manufacturing techniques to control acoustic impedance and attenuation without boundary layer reflections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional techniques are used to form multiple attenuation zones in a backing component, then variable attenuation property is achieved, but boundary layer effect occurs resulting in poor image quality
Solution Approach 1:
The patent applies parameter changes by continuously varying the packing density of the first material (acoustic scatterers/absorbers) throughout the thickness of the backing component. This creates a gradual transition in acoustic impedance and attenuation properties, eliminating the abrupt boundaries that cause layer effects in conventional multi-zone designs. The continuous parameter variation achieves variable attenuation while maintaining image quality.
Solution Approach 2:
The patent uses a composite material structure consisting of a first material (acoustic scatterers or absorbers) distributed within a second material (matrix material). By controlling the packing density of the first material throughout the thickness, the composite structure provides continuous variable attenuation properties without requiring discrete layered zones, thereby avoiding boundary layer effects.
2Reliability
If a backing component has variable attenuation material property in the Z-axis direction, then acoustic signal reflection is minimized and pulse duration is controlled, but manufacturing complexity increases
Solution Approach 1:
The patent employs parameter changes by controlling the packing density of the first material as a continuous function of the Z-axis position. This allows the backing component to achieve variable attenuation and impedance control in a single monolithic structure, eliminating the need for multiple discrete layers or zones that would increase manufacturing complexity.
Solution Approach 2:
The patent merges multiple functions (attenuation, impedance control, and reflection minimization) into a single monolithic backing component structure. By integrating variable attenuation properties throughout the thickness rather than using separate layers, the design simplifies manufacturing while achieving reliable acoustic signal control.
3Manufacturing precision
If additive manufacturing techniques are used to create a unitary structure with variable packing density, then boundary layer effect is eliminated, but manufacturing process complexity increases
Solution Approach 1:
The patent utilizes additive manufacturing to implement continuous parameter changes in the packing density of the first material throughout the backing component thickness. This approach eliminates boundary layer effects by creating a monolithic structure with gradual property transitions, while the additive manufacturing process inherently handles the complexity of variable density fabrication more easily than conventional methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces ultrasound wave reflections and enhances image quality by providing a continuous and controlled attenuation of acoustic signals, improving the specificity and performance of ultrasound probes.
Implementation Method 1
The first material is acoustic scatterers or absorbers
Implementation Method 2
The first material is acoustic scatterers or absorbers
Implementation Method 3
The variation in packing density of the first material provides a variable attenuation property in a Z-axis direction of the backing component and controls the impedance of acoustic signals travelling in the backing component
Data Source
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AI summary
A backing component (20) configured to receive and attenuate transmitted acoustic signals from a transducer element (16) in an ultrasound probe (10) is disclosed. The backing component (20) has a unitary structure of a first material (22) and a second material (24), and a variation in packing density of the first material (22) across at least a portion (26) of a thickness of the backing component (20). Further, a method of making a backing component (20) for a transducer element (16) in an ultrasound probe (10) is disclosed. The method includes performing an additive manufacturing technique using a first material (22) and a second material (24) to form the backing component (20) that has a unitary structure of the first material (22) and the second material (24). Performing the additive manufacturing technique involves varying a packing density of the first material (22) across at least a portion (26) of thickness of the backing component (20).