Backing Plate Features for Uniform IC Contact Force
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Solution Overview
Problem
Existing LGA socket assemblies face challenges with nonuniform mating force due to thermal stress and high tightening forces, leading to mechanical deformation and inefficient contact between the IC module and the PCB, which existing solutions like polymer layers or force adjustable members fail to address effectively, especially in high packaging density systems.
Innovation Solution
A backing plate with manufactured features on its top surface is introduced, which integrates protrusions or bumps to apply pressure uniformly, allowing for precise control of contact force distribution and reducing the overall height of the assembly, eliminating the need for additional materials and complex handling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If high tightening forces are applied to ensure contact between the IC module and PCB, then the contact force is sufficient, but mechanical deformation occurs on the bottom surface of the module and top surface of the connector resulting in nonuniform mating force
Solution Approach 1:
The backing plate incorporates localized manufactured features (protrusions, bumps, or recesses) at specific positions to create non-uniform force distribution that compensates for deformation. These features apply concentrated local forces where needed to maintain uniform overall contact pressure across the mating surface.
Solution Approach 2:
The invention changes the physical parameters of the backing plate by introducing manufactured features with specific geometries (height, width, spacing) to modify the force distribution pattern. This transforms the uniform backing plate into a non-uniform structure that produces the desired uniform contact pressure through strategic local variations.
2Manufacturing precision
If polymer layers are inserted between the backing plate and PCB to correct deformation, then contact uniformity is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The manufactured features are integrated directly into the backing plate structure, merging the correction function with the existing backing plate component. This eliminates the need for separate polymer layers and reduces assembly steps while achieving the same contact uniformity improvement.
Solution Approach 2:
The invention extracts the correction function from separate polymer layers and embeds it directly into the backing plate through manufactured features. This removes the need for additional materials and simplifies the overall assembly by consolidating functions into a single component.
3Length of stationary object
If the overall height of the assembly is reduced for high packaging density, then space efficiency is improved, but the ability to apply sufficient mating force is compromised
Solution Approach 1:
The manufactured features create localized force concentration points that generate high mating force in a compact configuration. By concentrating force application at specific locations rather than distributing it uniformly across a large volume, the design achieves sufficient mating force with reduced overall assembly height.
Solution Approach 2:
The invention transitions from a uniform three-dimensional structure to a design that utilizes surface-level manufactured features. This allows force application optimization in the horizontal plane while minimizing vertical dimension, achieving high mating force with reduced assembly height.
Data Source
AI summary
In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.