Backlight Module Abutting Structures LED Alignment

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Solution Overview

Problem

Conventional backlight modules experience light leakage and uneven brightness due to the thickness of adhesives used to attach the light guide plate to the circuit board, leading to misalignment of light-emitting diodes and the light guide plate, resulting in bright bands and reduced optical quality.

Innovation Solution

The use of abutting structures on the flexible circuit board to deform and adjust the position of light-emitting elements relative to the light guide plate, compensating for the thickness of adhesives and improving the coupling effect between the light guide plate and light-emitting elements, thereby reducing light leakage and enhancing uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesives are used to fix the light guide plate on the circuit board, then the light guide plate can be attached, but the thickness of the adhesives causes misalignment between light-emitting diodes and the light guide plate, resulting in light leakage and uneven brightness

Engineering Contradiction:
Improveattachment methodVSAvoidalignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The adhesive layer is segmented into multiple discrete adhesive points rather than a continuous layer. This segmentation allows the light guide plate to be positioned at multiple contact points, enabling compensation for thickness variations and achieving better alignment between LEDs and the light guide plate while maintaining easy attachment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution introduces a vertical dimension adjustment by designing the light guide plate with a curved or uneven bottom surface that corresponds to the adhesive distribution. This dimensional change allows the top surface of the light guide plate to be coplanar with the LEDs despite the presence of adhesive thickness, resolving the alignment issue.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If the light guide plate is completely attached to the circuit board, then attachment strength is improved, but the light-emitting surface cannot be aligned with the central axis of the light incident surface, causing bright bands

Engineering Contradiction:
Improveattachment strengthVSAvoidbrightness uniformity
Core Design Contradiction:
StrengthVSIllumination intensity

Solution Approach 1:

The light guide plate is designed with different surface qualities at different locations. The bottom surface has localized contact areas that correspond to adhesive positions, while the top surface maintains a coplanar, uniform quality for consistent light emission. This local differentiation allows strong attachment at specific points while maintaining overall brightness uniformity.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If adhesive thickness is reduced to improve alignment, then alignment precision improves, but attachment reliability deteriorates

Engineering Contradiction:
Improvealignment precisionVSAvoidattachment reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The adhesive system is segmented into multiple discrete points rather than a thin continuous layer. This segmentation allows each adhesive point to provide strong localized bonding while the overall thickness remains controlled, achieving both high attachment reliability and good alignment precision simultaneously.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the risk of light leakage and bright lines, improving overall light uniformity and allowing for the design of ultra-thin display devices by aligning light-emitting elements with the light guide plate, thus enhancing the optical quality and reducing the device thickness.

Implementation Method 1

the flexible circuit board is deformed at the position of the abutting structures

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12078841B2Backlight module and display device
Publication Date: 2024.09.03 RADIANT OPTO ELECTRONICS CORP
  • US12078841B2 patent drawing
  • US12078841B2 patent drawing
  • US12078841B2 patent drawing

AI summary

A backlight module comprises an outer frame unit, a light guide plate arranged in the outer frame unit, a light-emitting unit, a plurality of adhesives for fixing the light-emitting unit on the light guide plate, and a plurality of abutting structures. The light-emitting unit includes a flexible circuit board and a plurality of light-emitting elements arranged on the flexible circuit board at intervals. Part of the flexible circuit board is deformed at a specific position by the abutting structures, and the position of the light-emitting elements relative to the light guide plate can be adjusted. Thereby, the light-emitting elements can be aligned with the light incident surface of the light guide plate, prevent light from leaking from the light emitting surface of the light guide plate close to the light-emitting elements, and reduce the generation of bright lines and improving the overall uniformity. The present invention also provides a display device including the backlight module.