Backlight Assembly Adhesion Member Thermal Expansion
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Solution Overview
Problem
In edge-illumination type backlight assemblies for display apparatuses, the increased number of light-emitting diodes leads to thermal expansion of the light guide plate, causing non-uniform luminance and light loss due to changed distances between light-emitting diodes and the light guide plate, resulting in decreased light efficiency and uneven luminance.
Innovation Solution
A backlight assembly design that includes a light-emitting module, a receiving container, and a light guide plate, where a main adhesion member and a sub adhesion member are used to stably fix the light guide plate, maintaining uniform distance and preventing deformation, thereby minimizing light loss and ensuring consistent luminance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of light-emitting diodes is increased, then the luminance of the backlight assembly is improved, but the light guide plate undergoes thermal expansion causing non-uniform luminance and light loss
Solution Approach 1:
The patent applies parameter changes by using adhesion members with specific adhesive properties that can accommodate thermal expansion. The adhesive members are selected or designed to maintain stable bonding between the light guide plate and circuit board across temperature variations, allowing the system to tolerate thermal expansion without losing structural stability or optical performance.
Solution Approach 2:
The adhesion members act as intermediaries between the light guide plate and the circuit board. These intermediaries absorb and compensate for thermal expansion effects, maintaining the positional relationship and distance between the light-emitting diodes and the light guide plate incident surface even when temperature changes cause expansion.
2Illumination intensity
If the number of light-emitting diodes is increased, then the luminance is improved, but the distance between light-emitting diodes and light guide plate changes causing light loss
Solution Approach 1:
The adhesion members are designed with specific thickness and adhesive properties that maintain the optimal distance between the light-emitting diodes and the light guide plate incident surface. Even when thermal expansion occurs, the adhesion members compensate for dimensional changes to keep the distance within an optimal range for light transmission efficiency.
Solution Approach 2:
The adhesion members provide beforehand cushioning by pre-accommodating potential thermal expansion. The adhesive layer is designed to allow for expansion movement while maintaining stable bonding, preventing future misalignment or distance changes that would cause light loss.
3Illumination intensity
If the number of light-emitting diodes is increased, then the luminance is improved, but the luminance uniformity deteriorates due to thermal expansion
Solution Approach 1:
The adhesion members are designed with uniform properties and consistent thickness across the light guide plate surface. This ensures that thermal expansion is distributed uniformly, preventing localized deformations that would cause non-uniform luminance. The adhesive parameters are selected to maintain consistent bonding pressure and distance across the entire assembly.
Solution Approach 2:
The patent applies homogeneity by using uniform adhesion members across the entire light guide plate. This ensures that all regions of the light guide plate experience similar thermal expansion constraints, maintaining uniform distance from the light-emitting diodes and achieving even luminance distribution across the display surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light efficiency and luminance uniformity by maintaining a stable distance between the light guide plate and the light-emitting module, even when the light guide plate thermally expands, reducing light loss and minimizing sheet warpage.
Implementation Method 1
a main adhesion member and a sub adhesion member are used to stably fix the light guide plate
Implementation Method 2
a light guide plate... guides light provided from the first light source
Implementation Method 3
a light-emitting diode having high luminance is generally used
Implementation Method 4
a first light source on the first mounting surface
Implementation Method 5
the light guide plate is thermally expanded by heat emitted from the light-emitting diodes
Implementation Method 6
the light guide plate is thermally expanded by heat emitted from the light-emitting diodes
Data Source
AI summary
A backlight assembly includes a first light-emitting module, a light guide plate, a receiving container and a main adhesion member. The first light-emitting module includes a first circuit board including a first mounting surface, and a first light source on the first mounting surface. The light guide plate is on the first mounting surface and guides light from the first light source. The receiving container includes a bottom portion and receives the first light-emitting module and the light guide plate. The main adhesion member is between the first mounting surface and the light guide plate and is attached to the first circuit board and the light guide plate, and is between the light guide plate and the bottom portion and movable with respect to the light guide plate.