Backlight Adhesive Opening Layout to Prevent Light Guide Shifting
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Solution Overview
Problem
The existing backlight modules face challenges in reducing the risk of shifting between the light guide plate and the circuit board, which affects the stability and performance of electronic devices.
Innovation Solution
The proposed solution involves an adhesive structure with segmented elements, where the second part of the adhesive structure has a greater maximum width than the first part, allowing for a larger attachment area and increased adhesion between the light guide plate and the circuit board, while minimizing interference with light-emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive structure uses a uniform width design, then the manufacturing process is simple, but the adhesion area between the light guide plate and circuit board is limited
Solution Approach 1:
The adhesive structure is divided into multiple segments with different widths. The first adhesive segment has a first width, the second adhesive segment has a second width greater than the first width, and the third adhesive segment has a third width greater than the second width. This segmentation increases the total adhesion area between the light guide plate and circuit board while maintaining manufacturing feasibility through a systematic width progression design.
2Strength
If the adhesive structure is made larger to increase adhesion, then the attachment area increases, but it may interfere with the light-emitting elements
Solution Approach 1:
The adhesive structure employs local quality variation by assigning different widths to different segments. The first adhesive segment has a narrower width suitable for areas near light-emitting elements, while the second and third segments have progressively greater widths in areas where light interference is less critical. This allows the adhesive structure to maximize adhesion area while locally adapting to avoid interfering with light emission.
3Strength
If the adhesive structure uses varying widths for different segments, then the adhesion is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The adhesive structure is divided into distinct segments (first, second, and third adhesive segments) with clearly defined width relationships. The first segment has width W1, the second has width W2 > W1, and the third has width W3 > W2. This segmentation approach allows for systematic manufacturing by defining clear width progression rules, making it easier to control precision during the bonding process compared to a completely variable width design.
Data Source
AI summary
A electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The backlight module includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate. A second maximum width of the second part is greater than a first maximum width of the first part along the first direction.