Backlight Circuit Board Side-Reflecting Cover Film Structure
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Solution Overview
Problem
Existing backlight technologies using Mini LEDs struggle to achieve high light reflectivity on the sides, which limits the brightness and performance of LED display screens with small-pitch applications.
Innovation Solution
A circuit board manufacturing method that includes an insulating base layer with a conductive circuit layer, a solder mask layer with a slot to expose a solder pad, and a cover film with a light diffusing material and side reflecting portion to enhance light reflectivity on the sides, where the side reflecting portion is pressed onto the solder mask layer's sidewall to increase light reflectivity when connected to a light emitting element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If ink is printed on the entire surface of the product with increased thickness to allow the substrate to have high light reflectivity, then the light reflectivity of the substrate is improved, but the light reflectivity at the side of the backlight cannot be achieved
Solution Approach 1:
The patent transitions from a two-dimensional surface coating approach to a three-dimensional structure by forming a groove in the solder mask layer and filling it with a light diffusing and reflecting layer. This vertical dimensionality change enables light reflection from the side of the backlight, solving the limitation of conventional surface-only treatments.
Solution Approach 2:
Instead of uniformly increasing ink thickness across the entire surface, the patent applies the light diffusing and reflecting layer locally within the groove structure. This localized approach achieves high light reflectivity where needed (in the groove and at the side) without unnecessarily increasing overall material thickness or complexity elsewhere.
2Illumination intensity
If a conventional solder mask layer is used without side reflecting structures, then the manufacturing process is simple, but high light reflectivity at the side of the backlight cannot be achieved
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the groove formed in the solder mask layer serves both as a structural feature and as a container for the light diffusing and reflecting layer. The sidewall of the groove itself becomes part of the light reflection system, merging the mask function with the light management function in one element.
Solution Approach 2:
The patent uses a composite structure consisting of the solder mask layer material combined with a light diffusing and reflecting layer material filled into the groove. This composite approach enables the system to achieve both the protective/masking function of the solder mask and the light reflection function of the filling material within a single manufactured component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves light reflectivity on the sides of the backlight, enhancing the brightness and performance of Mini LED display screens by integrating a side reflecting portion that increases light reflectivity to a higher level without increasing the thickness of the solder mask layer, thus maintaining uniformity and precision.
Implementation Method 1
the cover film includes a first light diffusing material
Data Source
AI summary
A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).