Backlight Module Bracket with Segmented Adhesive
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Solution Overview
Problem
The challenge is to reduce the thickness of backlight modules in electronic devices while preventing light leakage, as existing solutions face difficulties in miniaturization due to the mismatch between light guide plates and LEDs, leading to increased costs and assembly complexities.
Innovation Solution
A backlight module design featuring a bracket with a light emission module and a reflective film, where the first adhesive structures project vertically on the bracket, allowing the light emission elements to project without overlapping, and a flexible reflective film serves as a joint between the bracket and light guide plate, preventing light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the backlight module is reduced, then the device becomes thinner and lighter, but the assembly becomes more difficult and light leakage occurs due to mismatch between light guide plate and LED sizes
Solution Approach 1:
The adhesive is divided into multiple adhesive structures (first adhesive structure and second adhesive structure) positioned at different locations. The first adhesive structure is disposed at a first position and the second adhesive structure is disposed at a second position, allowing the light guide plate to be assembled in segments rather than requiring perfect alignment across the entire surface, thus reducing assembly difficulty in thin configurations
Solution Approach 2:
The reflective film acts as an intermediary component between the light emission elements and the light guide plate. It fills the gap caused by size mismatch between LEDs and light guide plate, preventing light leakage while maintaining the thin overall structure without requiring precise alignment
2Length of moving object
If the thickness of the backlight module is reduced, then the device becomes thinner and lighter, but the cost of reducing LED thickness becomes quite high
Solution Approach 1:
Instead of changing the thickness parameter of the LEDs (which incurs high cost), the patent changes the arrangement parameters of the adhesive structures and reflective film positioning. The adhesive structures are disposed at specific first and second positions, and the reflective film is positioned to bridge gaps, achieving thin module thickness through parameter optimization rather than expensive component thinning
Solution Approach 2:
The reflective film serves as a cost-effective intermediary that prevents light leakage without requiring expensive thin LEDs. By positioning the reflective film to cover gaps between light emission elements and the light guide plate, the system achieves thin configuration through a low-cost additive rather than through expensive component reduction
3Ease of manufacture
If adhesive is used on the bracket to secure components, then assembly is enabled, but the adhesive may be too thick and block entrance of the light guide plate into the bracket
Solution Approach 1:
The adhesive is segmented into multiple discrete adhesive structures positioned at different locations (first adhesive structure at first position, second adhesive structure at second position). This segmentation allows the light guide plate to navigate around and between the adhesive structures during assembly, preventing thick adhesive from blocking the entrance while still providing secure attachment points
Solution Approach 2:
The adhesive structures are arranged in a distributed spatial pattern rather than forming a continuous layer. By positioning adhesive structures at multiple discrete locations across the bracket, the design maintains assembly functionality while creating clearance paths in the vertical dimension for the light guide plate to pass through
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the thickness of the backlight module, facilitates easier assembly, and prevents light leakage by using non-overlapping adhesive and light emission element projections, enhancing the module's efficiency and reducing material costs.
Implementation Method 1
The reflective film is disposed between the light emission elements and the first plate
Implementation Method 2
The reflective film is mounted on the first plate of the bracket through the first adhesive structures
Data Source
AI summary
The backlight module includes a bracket, a light emission module, a reflective film, and first glue structures. The bracket has a first plate and a second plate opposite to each other, and a third plate connecting the first plate to the second plate. The light emission module is disposed between the first plate and the second plate and includes light emission elements. The reflective film is disposed between the light emission elements and the first plate. The reflective film is mounted on the first plate of the bracket through the first adhesive structures. The first adhesive structures vertically project on the first plate at a plurality of first areas respectively, the light emission elements vertically project on the first plate at a plurality of second areas respectively, and the first areas do not overlap with the second areas.