Backlight Unit Chassis with Integrated Circuit Pattern

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Solution Overview

Problem

Conventional backlight units for liquid crystal displays using light emitting diodes (LEDs) are complex and costly due to the need for multiple printed circuit boards (PCBs), connectors, and screws, which complicate manufacturing and assembly, and do not efficiently manage heat radiation.

Innovation Solution

A backlight unit with a chassis having insulating and conductive circuit patterns directly formed on it, eliminating the need for additional PCBs, connectors, and screws, and utilizing anodized aluminum layers for improved heat radiation, where LEDs are mounted directly on the circuit pattern.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If multiple PCBs with mounted LEDs are used to achieve sufficient luminous flux, then the required light output is improved, but the device complexity and manufacturing cost increase due to need for connectors, screws, and gap pads

Engineering Contradiction:

Improveluminous fluxVSAvoidnumber of parts

Core Design Contradiction:

Illumination intensityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate PCBs and their associated mounting components (connectors, screws, gap pads) into a single integrated PCB structure. The LED array is directly mounted on this unified PCB, eliminating the need for multiple separate circuit boards and their interconnection hardware, thereby reducing part count while maintaining required luminous flux output

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single PCB serves multiple functions simultaneously: it provides the circuit board function for electrical connections, the structural support function previously requiring separate chassis elements, and the mounting platform for the LED array. This multi-functional integration eliminates the need for separate connectors and mounting hardware

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If connectors are used to electrically connect divided PCBs, then the required LED array coverage is improved, but the manufacturing time and assembly complexity increase

Engineering Contradiction:

ImproveLED array coverageVSAvoidassembly time

Core Design Contradiction:

Area of stationary objectVSLoss of time

Solution Approach 1:

The patent combines multiple divided PCBs into a single unified PCB structure that provides sufficient area for the LED array. This eliminates the need for connectors to join separate PCBs, allowing the LED array to be mounted on a continuous circuit board without interruption, thus maintaining full coverage while dramatically reducing assembly steps and time

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If gap pads are used to radiate heat from LEDs, then heat radiation is improved, but the material cost increases due to use of expensive gap pad material

Engineering Contradiction:

Improveheat radiationVSAvoidmaterial cost

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The patent extracts and eliminates the gap pad component from the heat radiation system. Instead of using expensive gap pad material to facilitate heat transfer, the design allows direct thermal contact between the LED array and the PCB, utilizing the PCB's own thermal properties and structure for heat dissipation, thereby achieving effective heat radiation without the additional material cost

Inventive Principle:

Principle #2Taking out (Extraction)

4Strength

If screws and engaging units are used to fix PCBs to chassis, then mechanical stability is improved, but the assembly process becomes time-consuming and less efficient

Engineering Contradiction:

Improvemechanical stabilityVSAvoidassembly efficiency

Core Design Contradiction:

StrengthVSProductivity

Solution Approach 1:

The patent merges the PCB mounting function with the PCB structure itself by designing a single integrated PCB that can be directly installed without requiring separate engaging units or screws. The unified PCB structure provides inherent mechanical stability through its design, eliminating the need for additional fastening components and significantly simplifying the assembly process to improve productivity

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the manufacturing process, reduces material and labor costs, enhances heat radiation efficiency, and allows for easier assembly and automation, resulting in a more efficient and cost-effective backlight unit.

Implementation Method 1

a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

utilizing anodized aluminum layers for improved heat radiation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7914194B2Backlight unit having light emititng diodes and method of manufacturing the same

Publication Date: 2011.03.29 SAMSUNG ELECTRONICS CO LTD

AI summary

There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern.